WMSIC Electronic Components

UNI-ROYAL 0402WGF5102TCE

Model0402WGF5102TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF5102TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF5102TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
51kΩ
Electronic Component
50
Electronic Component
BM0257242465
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF5102TCE 产品概述

一、产品简介

0402WGF5102TCE 为 UNI-ROYAL(厚声)系列的贴片厚膜电阻,封装尺寸为 0402(公制 1005/英制 0402)。标称阻值 51kΩ,精度 ±1%,适用于对体积与可靠性有较高要求的小型化电子产品。该器件以稳定的电阻值、良好的温度特性和广泛的工作温度范围为特点,适合批量表面贴装生产和自动化装配。

二、主要参数

  • 电阻类型:厚膜电阻(贴片)
  • 封装:0402
  • 标称阻值:51kΩ
  • 精度:±1%(±1% 表示高精度等级)
  • 额定功率:62.5 mW(典型额定功率,基于 0402 尺寸)
  • 额定工作电压:50 V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55℃ 至 +155℃
  • 品牌:UNI-ROYAL(厚声)

三、特性与优势

  • 小型化封装:0402 体积小、占板面积少,适合高密度布板与便携产品。
  • 精度较高:±1% 满足多数精密分压、偏置与反馈网络的需求。
  • 宽温区性能稳定:-55℃ 至 +155℃ 的工作温度保证在恶劣环境下仍能可靠工作。
  • 良好温漂:±100 ppm/℃ 的 TCR 对一般精度电路影响较小,有利于温度敏感电路的稳定性。
  • 兼容贴片工艺:适用于常规 SMT 自动贴装与回流焊流程,便于量产。

四、典型应用场景

  • 手持与可穿戴设备中的分压与偏置网络。
  • 消费类电子、通信终端与物联网模块的电阻矩阵。
  • 工业控制与测量仪器中的参考和阻值网络(对中等精度要求场合)。
  • 阻抗匹配、滤波网络与串联限流应用(需注意功率与电压限制)。

五、选型与使用注意

  • 功率与降额:0402 的额定功率有限,实际使用中应考虑降额和 PCB 散热条件,避免长期在额定功率附近工作。
  • 电压限制:不可超过 50V 的工作电压;若电路有高电压脉冲或瞬态,请选用更高电压等级或采取限压措施。
  • 温度影响:TCR ±100 ppm/℃ 在宽温度变化时仍会带来阻值漂移,关键计量场合可考虑配套温度补偿或更低 TCR 的器件。
  • 焊接工艺:兼容常见回流焊,但应遵循厂商建议的回流曲线与预热/冷却规范,以降低热应力与焊点缺陷。

六、可靠性与储存

  • 存储建议:避免潮湿与腐蚀性气体,推荐相对湿度 < 60%,常温环境下密封保存。
  • 可靠性测试:厚膜结构具有良好的振动与冲击耐受性,适合一般工业与消费级的机械环境。需关注长期功率应力下的阻值漂移,必要时进行寿命验证。

七、包装与采购提示

  • 常见包装形式为卷带(Tape & Reel),便于 SMT 自动化贴装。
  • 下单时请确认所需阻值、精度以及包装单位(卷长或每盘数量),并核对是否需 RoHS/无铅合规证书。

如需样品测试或更详细的回流焊曲线、可靠性测试数据与寿命评估报告,可联系供应商技术支持,以便在具体应用中获得最佳性能与可靠性保障。

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