Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMJ0104TEE是厚声电子(UNI-ROYAL)推出的通用型厚膜贴片电阻,核心参数精准匹配中低端电子电路的设计需求:
封装尺寸仅0.6mm(长)×0.3mm(宽)×0.23mm(厚),相比0402封装体积缩小约70%,能显著提升PCB布局密度,适配智能手机、智能穿戴等便携设备的高密度设计需求,帮助产品实现小型化、轻量化。
产品以氧化铝陶瓷为基底,通过厚膜丝网印刷技术制造:先印刷电阻浆料,经高温烧结固化形成电阻层,再完成电极制备、调阻等工序。厚膜工艺兼具两大核心优势:
±5%的精度虽不属于精密级(精密级通常≤±1%),但可满足90%以上通用电路需求,例如:
±200ppm/℃意味着温度每变化1℃,阻值变化±200×10⁻⁶。例如,温度从25℃升至125℃(变化100℃),100kΩ电阻的阻值范围为98kΩ~102kΩ,这一变化幅度在工业控制、消费电子场景中可接受。
-55℃+155℃的温度范围,覆盖低温户外(如北方设备)、高温车载(如仪表盘)等场景,远优于普通民用级电阻(通常0℃70℃)。
0201WMJ0104TEE因体积小、成本低、性能稳定,广泛应用于:
厚声电子(UNI-ROYAL)是国内领先的被动元器件制造商,拥有20余年电阻生产经验,产品通过ISO 9001、ISO 14001认证,符合RoHS 2.0、REACH环保法规。0201WMJ0104TEE采用标准化生产流程,每批次参数一致性高,可满足客户大规模量产需求。
该产品以高性价比、宽温可靠性适配多场景,是通用电子电路设计的优选组件。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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