WMSIC Electronic Components

UNI-ROYAL 1206W4F470JT5E

Model1206W4F470JT5E
Package1206
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 1206W4F470JT5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
1206W4F470JT5E
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
47Ω
Electronic Component
1
Electronic Component
BM0257341639
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1206W4F470JT5E 产品概述

一、产品简介

1206W4F470JT5E 是 UNI-ROYAL(厚声)推出的一款厚膜贴片电阻,封装为常见的1206(公制尺寸约3.2 mm × 1.6 mm)。标称阻值为47Ω,精度±1%(J级),额定功率250 mW,工作电压200 V,温度系数(TCR)为±200 ppm/℃,工作温度范围为-55℃至+155℃。该器件适用于一般电子设备中的阻抗匹配、限流、分压等场合,兼顾体积与功耗的平衡。

二、主要参数与性能特点

  • 电阻类型:厚膜电阻,工艺成熟,成本与良率优良。
  • 阻值与精度:47Ω,±1%(J),适合对阻值稳定性有一定要求的应用。
  • 功率与电压:额定功率250 mW,最高工作电压200 V,满足中低功率信号及电源旁路场合。
  • 温度特性:TCR ±200 ppm/℃,在温度变化时阻值漂移可控,但对极高精度温度敏感电路需注意补偿。
  • 环境范围:工作温度-55℃~+155℃,适配工业级温度要求。
  • 封装与可靠性:1206 封装便于自动贴装与回流焊接,机械强度与焊接可靠性良好。

三、典型应用场景

  • 信号级限流与阻抗匹配:音频、射频前端的阻抗整形及限流保护(需注意频率特性)。
  • 电源与控制电路:小功率电源滤波、分压采样、启动限流等。
  • 工业与消费电子:仪表、控制板、家电、通信设备等广泛通用场景。
  • PCB 功能模块:适合高密度贴装板卡的通用型电阻元件选择。

四、可靠性与环境适应性

该厚膜电阻在-55℃至+155℃温度范围内工作,满足一般工业环境的热循环及高低温要求。厚膜工艺对抗潮湿和机械冲击有良好表现,但在长期高功耗条件下需注意热耗散与热应力。对于关键应用建议参照制造商提供的可靠性试验数据(如湿热、温度循环、振动与焊接热稳性)来评估。

五、使用建议与注意事项

  • 功率散热:额定功率250 mW 为在规定环境条件下的标称值。设计时应预留适当裕量并采用功率降额(随环境温度升高按制造商曲线降额),避免长期在额定功率下满载工作。
  • 布局与散热:尽量在PCB上为电阻周围预留散热铜皮或通过孔,避免热聚集影响寿命与阻值漂移。
  • 焊接工艺:适用于常规回流焊工艺,建议遵循供应商的回流曲线与预热/保温要求,避免过高峰值温度和长时间高温。
  • 环境与存储:未贴装元件应存放于干燥、防静电包装内,避免潮湿和机械损伤。
  • 验证测试:在最终产品中使用前建议进行温度漂移、长期负载和冲击测试以确认性能满足系统要求。

六、采购与规格确认

标准型号为 1206W4F470JT5E,品牌 UNI-ROYAL(厚声)。在批量采购前请向供应商索取最新数据手册和封装尺寸图,以确认包装方式、试验报告与可追溯性(批次信息)。如应用对温漂、可靠性或特殊认证(如汽车级)有更高要求,请与厂商确认是否有相应型号或定制方案。

总结:1206W4F470JT5E 是一款适用于通用电子和工业场合的厚膜贴片电阻,结合1206封装的安装便利性和±1%阻值精度,适合在对体积、成本与性能均有平衡要求的电路中使用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.