WMSIC Electronic Components

UNI-ROYAL 0603WAF2700T5E

Model0603WAF2700T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF2700T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF2700T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
270Ω
Electronic Component
10
Electronic Component
BM0257245560
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF2700T5E 产品概述

一、主要特性

0603WAF2700T5E 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,阻值 270Ω,阻值精度 ±1%,额定功率 100mW,工作温度范围 -55℃~+155℃。封装为 0603(约 1.6mm × 0.8mm),适用于高密度表面贴装电路。温度系数(TCR)为 ±100ppm/℃,工频或直流工作电压标称可达 75V。

二、典型电气性能说明

  • 阻值:270Ω,误差 ±1%(公差等级 1% 满足多数精度电路需求)。
  • 额定功率:0.1W(在器件散热条件良好且遵循厂商热降额规范下)。
  • 温度系数:±100ppm/℃,对应阻值随温度变化约为 0.027Ω/℃(270Ω×100ppm)。100℃ 的温差大致造成 ≈2.7Ω 的变化(约 1%)。
  • 功率对应的最大安全电压:V = √(P·R) ≈ √(0.1×270) ≈ 5.2V(因此在设计时须同时满足功率和耐压约束;标称 75V 为绝缘/耐压上限,不能以此替代功率限制)。

三、热管理与使用注意

0603 小体积限制了散热能力,长期或近额定功率运行将加速漂移和失效。建议在设计时留有功率裕量(常见做法是 50% 以上余量),并避免在最高环境温度下满载运行。布线应最大化散热通道,焊盘焊膏量与铺铜面积会显著影响热阻。

四、典型应用

适用于信号处理、滤波网络、电流分流、基准与偏置电路、便携设备与消费电子中要求中等精度的分压/限流应用。因尺寸小、成本低,常用于大批量生产的贴片化设计。

五、封装与装配建议

该型号适配自动贴装与回流焊工艺。推荐使用标准卷带供料,贴装后应采用推荐回流曲线及严格控制峰值温度与时间,避免过热导致电阻性能退化。存储与操作应注意防潮、防尘及静电防护。

六、可靠性与选型提示

厚膜电阻具有良好的性价比与可焊性,但在长期稳定性与低温漂要求较高的场合不如金属膜系列。选型时综合考虑温度系数、功率裕量与环境温度,如需更高稳定性或更低 TCR,可考虑更高等级或其它材料系列。欲获取完整电气表格与热降额曲线,请参照厂商数据手册或联系 UNI-ROYAL 技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.