Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0805W8F1500T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0805W8F1500T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0805W8F1500T5E
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.027g
- Electronic Component
- 150Ω
- Electronic Component
- 1
- Electronic Component
- BM0228745298
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805W8F1500T5E 产品概述
一、产品概述
0805W8F1500T5E 为 UNI-ROYAL（厚声）品牌的贴片厚膜电阻，0805 封装（公制 2012），额定功率 125mW，阻值 150Ω，精度 ±1%，温度系数(TCR) ±100ppm/℃，工作温度范围 -55℃ 至 +155℃，最高工作电压 150V。该器件面向对体积、温度范围和稳定性有要求的一般电子产品与工业应用，具有成本效益高、兼容常规 SMT 制程的特点。
二、主要性能参数
- 阻值：150Ω
- 精度：±1%（符合高精度分档要求）
- 功率：125mW（环境及封装条件下额定值）
- 工作温度：-55℃ ~ +155℃
- 温度系数：±100ppm/℃
- 结构类型：厚膜电阻，表面贴装
- 允许工作电压：150V（不得超过额定值以免产生破坏性电应力）
三、典型应用场景
- 工业控制与测量仪表（宽温工作要求）
- 通信设备、网络设备中的偏置与分流电路
- 汽车电子（非安全关键回路）与消费类电子模块
- 原型开发与量产中的通用限流、分压与阻尼用途
四、封装与装配建议
- 封装尺寸（典型）：0805（约 2.0 × 1.25 mm）
- 适配回流焊工艺，建议遵循厂家给出的回流温度曲线与焊盘尺寸（推荐按 IPC-7351 标准制定 PCB land pattern）以保证焊接可靠性与热散能力。
- 对于长时间、大功率应用，建议在 PCB 设计中增大铜箔散热面积并避免局部热聚集。
五、可靠性与使用注意事项
- 在高温环境或靠近热源位置，应按降额使用，避免持续满功率工作。
- 储存与使用时注意防潮、防污染，贴片盘或卷带应存放在干燥环境中，开封后尽快使用以降低焊接缺陷风险。
- 对于关键电路建议在样机阶段进行温度循环、负载寿命等可靠性验证，确认长期漂移与稳定性满足设计要求。
六、选型与采购提示
选择时请确认阻值容差、TCR 与工作温度范围是否满足系统要求；如需更低 TCR 或更高功率等级，可考虑金属膜或合金薄膜等替代方案。订购时按完整料号与包装形式（卷带/盘装）向供应商确认，以确保量产交付与贴片兼容性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
