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UNI-ROYAL 0402WGF5101TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF5101TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF5101TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 5.1kΩ
- Electronic Component
- 50
- Electronic Component
- BM0257242451
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF5101TCE 产品概述
一、产品简介
0402WGF5101TCE 是 UNI-ROYAL（厚声）出品的一款贴片厚膜电阻，封装尺寸为 0402（约 1.0 mm × 0.5 mm），标称阻值 5.1 kΩ，精度 ±1%。该器件面向高密度贴装、空间受限与对阻值稳定性有一定要求的电子产品，兼顾小尺寸与可靠性。
二、主要参数
- 电阻类型：厚膜电阻（SMD）
- 阻值：5.1 kΩ
- 精度：±1%（E24/E96 类别）
- 额定功率：62.5 mW（典型值，常温/推荐条件下）
- 工作电压：最大 50 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55 ℃ ~ +155 ℃
- 封装：0402（常用卷带包装，适配自动贴片机）
三、特点与优势
- 小型化：0402 封装适合高密度 PCB 布局与微型化终端设备。
- 精度与稳定性：±1% 精度配合 ±100 ppm/℃ 的温漂，适合精密分压、检测与信号处理场景。
- 通用电压与功率：50 V 的工作电压和 62.5 mW 的额定功率满足多数低功耗模拟和数字电路需求。
- 宽工作温度：-55 ℃ 到 +155 ℃，适应工业级及恶劣环境使用。
- 成熟工艺：厚膜工艺成本与可制造性兼顾，适合批量应用。
四、典型应用
- 移动终端、可穿戴设备与物联网节点的电阻阵列与分压网络。
- 精密分压、电平移位与滤波电路中的定值阻。
- 高密度控制板与测量仪器中的通用阻值元件。
- 需要长寿命、耐温循环与抗湿性的工业电子设备。
五、封装、焊接与使用建议
- 封装与贴装：0402 尺寸体积小，建议使用与封装尺寸匹配的 PCB 鼓墩（land pattern），焊盘应保证良好焊接且避免过大热通量差异。
- 降额使用：额定功率为 62.5 mW，建议在高温工况下按メーカー推荐的降额曲线使用；环境温度越高需越保守地减少通过功率以保证寿命与稳定性。
- 回流焊工艺：兼容常规无铅回流焊流程，建议根据 PCB 与元件的热特性调整峰值温度与保温时间，避免反复高温循环。
- 机械与清洗：贴片后避免强烈弯曲或机械应力，清洗时采用对厚膜电阻无腐蚀性的溶剂或工艺，注意干燥和残留物控制。
- 防护与可靠性：如需涂覆胶或涂层，请验证涂层材料与热循环、湿热环境的相容性，以免影响长期可靠性。
六、订购信息与型号说明
- 产品代码示例：0402WGF5101TCE（常见表示方式为：封装-系列-阻值代码-其他特性/包装编码）。
- 包装形式：常见为卷带（Tape & Reel），便于自动贴片机取料。
- 采购与替换：在选型时注意与电路中功率、最大电压及温漂匹配，必要时可咨询供应商获取样品和可靠性测试报告。
如需更多资料（封装尺寸图、推荐焊盘尺寸、回流焊曲线或可靠性测试数据），可提供具体需求，我将进一步补充。
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