WMSIC Electronic Components

UNI-ROYAL 0402WGJ0182TCE

Model0402WGJ0182TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGJ0182TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGJ0182TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
1.8kΩ
Electronic Component
10
Electronic Component
BM0257359116
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGJ0182TCE 产品概述

一、产品简介

0402WGJ0182TCE 是 UNI-ROYAL(厚声)出品的一款贴片厚膜电阻,标称阻值 1.8kΩ,精度 ±5%,封装尺寸为 0402(约 1.0 mm × 0.5 mm)。该器件为通用型低功率 SMD 电阻,适用于高密度组装的消费电子与工业控制板,为成本敏感、体积受限的电路提供稳定的限流、分压与阻抗匹配功能。

二、主要参数与性能

  • 阻值:1.8 kΩ(标称)
  • 精度:±5%(E24 系列)
  • 功率:62.5 mW(额定功率,常温下)
  • 最高工作电压:50 V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 结构:厚膜(陶瓷基底+厚膜阻性浆料)
    厚膜工艺在常温区具有良好稳定性和可重复性,抗冲击和焊接热应力能力较强,适合大量生产应用。

三、典型应用场景

  • 移动设备与可穿戴终端的限流、分压电路
  • IoT 传感器节点、低功耗模块的偏置网络
  • 家用电器与工业控制板上通用信号与测量回路
  • 涂层或保护要求不高的消费电子产品

四、封装与安装注意事项

  • 封装:0402(国际常用),适配自动贴装与回流焊工艺。
  • 回流焊建议按无铅工艺曲线,注意峰值温度与滞留时间以避免过热。
  • 为保证额定功率,PCB 布局应考虑热散逸:增加铜箔面积或采用热通孔可改善功耗承载。
  • 对于长期高温工作,应按厂商热降额曲线对功率进行降额处理(随环境温度上升额定功率下降)。

五、可靠性与储存

  • 工作温度范围宽,适合多种环境;厚膜结构抗湿热、抗机械应力表现良好。
  • 建议储存于干燥、常温环境,避免潮湿、酸碱性气体及长时间日晒;开卷后尽快使用以防吸湿影响焊接性。
  • 出货包装通常为卷带(Reel),便于 SMT 自动化装配。

六、选型建议

若电路对精度和温漂要求不高、且空间受限,0402WGJ0182TCE 是经济且可靠的选择。若对阻值精确度、长期漂移或噪声有更高需求,可考虑薄膜或金属膜电阻,或选择更高精度(±1%/±0.1%)与更低 TCR 的型号。最终选型建议参照具体电路工作温度、允许功耗以及制造装配工艺,并以厂家完整数据手册为准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.