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UNI-ROYAL 0603WAJ0121T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0603WAJ0121T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0603WAJ0121T5E
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.023g
- Electronic Component
- 120Ω
- Electronic Component
- 10
- Electronic Component
- BM0228745305
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603WAJ0121T5E 产品概述
本产品为 UNI-ROYAL（厚声）品牌的贴片厚膜电阻，封装尺寸为 0603（1608 公制），阻值 120Ω，精度 ±5%，额定功率 100mW，最大工作电压 75V，温度系数 ±100ppm/℃，工作温度范围 -55℃ 至 +155℃。适合要求尺寸小、成本低且可靠性较高的一般电子应用。
一、产品简介
0603WAJ0121T5E 属于厚膜薄型贴片电阻系列，体积小、质量轻，适用于高密度表贴电路板。典型应用包括分压、限流、阻抗匹配及一般阻值网络。其 100mW 的功率等级在 0603 封装中属于常见值，满足多数低功耗电路需求。
二、主要特性
- 封装：0603（1608）标准贴片尺寸，便于自动贴装与回流焊工艺。
- 阻值/精度：120Ω ±5%，适用于对阻值精度要求不高的场合。
- 功率与电压：额定功率 100mW，最高工作电压 75V（需考虑 PCB 散热和功率降额）。
- 温度特性：温度系数 ±100ppm/℃，工作温度 -55℃~+155℃，温度稳定性适中。
- 工艺：厚膜工艺制程，成本效益高，适合大批量生产。
三、电气与热性能要点
- 功率降额：在高温或散热条件受限时，需按厂方降额曲线处理（高温时额定功率会下降）。
- 温漂与稳定性：±100ppm/℃ 表明在温度变化时阻值漂移受控，但长期稳定性与金属膜等高端工艺相比略逊。
- 噪声与耐久：厚膜电阻的热噪声和接触噪声在某些精密模拟电路中需评估，适合一般数字与电源应用。
四、封装、焊接与可靠性建议
- 包装形式通常为卷带（Tape & Reel），便于贴片机使用。
- 推荐遵循常规回流焊工艺进行焊接，注意回流峰值温度与停留时间应控制在器件允许范围内以避免性能退化。
- PCB 设计时应保证良好散热路径与适当焊盘尺寸，以提高功率承受能力与长期可靠性。
- 储存与搬运避免潮湿、强震和污染，影响焊接性与电气性能。
五、典型应用场景
- 消费电子：手机配件、小型家电电路板的限流与分压。
- 工业控制与仪表：非高精度测量、信号调理中的阻值元件。
- 电源与转换器：低功率分压、电流检测前的限流或偏置。
- 物联网与可穿戴设备：对体积和成本敏感的低功耗模块。
六、选型与使用注意
- 若电路对温漂或长期稳定性要求较高，建议考虑更低 TCR 或金属膜/薄膜方案。
- 在高电压或需承受瞬态冲击的场景下，确认电压等级与能量承受能力是否满足要求。
- 设计时留出功率余量，遵循降额原则以延长寿命并提升可靠性。
总结：0603WAJ0121T5E 是一款面向通用电子产品的经济型厚膜贴片电阻，凭借小体积和成熟工艺，适合大批量装配和低成本设计。在使用时应关注 PCB 散热、功率降额以及回流焊工艺，以保证长期稳定性与可靠性。若需更详细的电气曲线或可靠性试验数据，建议联系供应商获取规格书与测试报告。
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