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UNI-ROYAL 0603WAF3002T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0603WAF3002T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0603WAF3002T5E
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 30kΩ
- Electronic Component
- 10
- Electronic Component
- BM0227584856
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603WAF3002T5E 产品概述
一、产品简介
0603WAF3002T5E 为 UNI-ROYAL（厚声）出品的贴片厚膜电阻，封装 0603（约 1.6 × 0.8 mm），标称阻值 30 kΩ，精度 ±1%，额定功率 100 mW，工作电压 75 V，温度系数（TCR）±100 ppm/℃，工作温度范围 -55 ℃ ~ +155 ℃。适用于要求体积小、精度中高、稳定性良好的通用电子电路。
二、主要技术参数
- 电阻类型：厚膜电阻
- 阻值：30 kΩ
- 精度：±1%（1/100）
- 额定功率：100 mW（封装热能力限制）
- 最高工作电压：75 V
- 温度系数：±100 ppm/℃
- 工作温度：-55 ℃ ~ +155 ℃
- 封装：0603（SMD，适用于自动贴片）
三、性能特点
- 体积小、重量轻，适合密集贴装电路板。
- 精度 ±1% 满足一般精密分压、滤波、偏置网络要求。
- ±100 ppm/℃ 的 TCR 在中等温度变化环境下保持较好阻值稳定性。
- 宽温度范围与厚膜工艺提供良好的机械和热可靠性。
四、典型应用场景
- 移动终端与便携设备的分压、限流与偏置电路；
- 工业控制与仪表中的信号处理与电平设定；
- 通信设备、消费电子和照明驱动（如 LED 阻流限流）；
- 高密度 PCB 设计、表面贴装自动化生产线。
五、封装与装配建议
- 封装 0603 适用于自动贴装，推荐使用卷带（tape & reel）供料。
- 焊接建议遵循制造商推荐的回流焊工艺（参考 J-STD-020 标准），避免超过器件热极限；对回流峰值温度及保温时间请参照供应商数据表。
- 焊盘设计和铜箔面积会影响功率散热，需根据 PCB 热管理适当布线和增加散热铜箔或过孔以提高功率承受能力。
六、可靠性与品质控制
UNI-ROYAL 厚膜电阻采用成熟的厚膜工艺，通常通过耐焊接热、湿热、温度循环、机械弯曲等常规可靠性试验。实际项目中建议在目标环境下做样品验证（热循环、长期加速老化、噪声和阻值漂移测试）以确认长期稳定性。
七、储存与订购建议
- 储存环境建议干燥、避免强光及腐蚀性气体；对长时间储存的卷带器件请注意防潮处理。
- 订购时请使用完整料号：0603WAF3002T5E，并向供应商确认是否为无铅/RoHS 版本、包装规格（卷盘尺寸与数量）及出货前的检验要求。
如需该型号的详细尺寸图、回流焊曲线或可靠性认证报告（如样件测试数据、环境应力筛选结果），可提供后向供应商/代理索取或告知我为您进一步查找。
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