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UNI-ROYAL 0201WMJ0220TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMJ0220TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000
Technical parameters
- Power
- 50mW
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMJ0220TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 22Ω
- Electronic Component
- 50
- Electronic Component
- BM0227340700
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMJ0220TEE 产品概述
一、产品简介
0201WMJ0220TEE 是 UNI-ROYAL（厚声）推出的一款超小型厚膜贴片电阻，阻值 22Ω，精度 ±5%，额定功率 50 mW，工作温度范围 -55℃ 至 +155℃。该系列采用 0201 微小封装，适配高密度、轻薄化电路板设计，针对消费电子、可穿戴和物联网终端等对体积与可靠性有较高要求的场景。
二、主要技术参数
- 阻值：22 Ω
- 精度：±5%
- 温度系数（TCR）：±200 ppm/℃
- 额定功率：50 mW（在规定环境下）
- 额定工作电压：25 V
- 工作温度范围：-55℃ ~ +155℃
- 阻抗类型：厚膜电阻
- 封装：0201（超小型 SMD）
- 品牌：UNI-ROYAL（厚声）
- 型号：0201WMJ0220TEE
注：按额定功率计算的连续电流约为 47.7 mA，对应的电压降约 1.05 V；虽然器件标称最大工作电压为 25 V，但长期使用时应同时遵守功率限制以避免过热损坏。
三、性能与特点
- 小型化：0201 封装便于实现高密度布线和轻薄化产品设计。
- 成本效益高：厚膜工艺制造成本低，适合大批量量产。
- 宽温度范围：-55℃ 至 +155℃ 的工作温度满足多数工业级与消费类环境需求。
- 稳定性适中：±200 ppm/℃ 的温度系数和 ±5% 的容差，适用于通用电路中的限流、分压、上拉/下拉等应用。
- 制程兼容：兼容常见 SMT 回流焊流程（请按厂商推荐的回流温度曲线操作以保证可靠性）。
四、典型应用场景
- 移动设备与可穿戴设备的阻值网络、阻尼与限流应用；
- 物联网终端、传感器节点中的空间受限电路；
- 高密度 PCB 中的分压、上拉/下拉与测试点；
- 需要低成本、低功耗的批量消费电子产品。
五、选型与使用建议
- 功率与电压：在设计时应确保实际工作电流与电压产生的功率消耗低于额定 50 mW，避免长期过载。
- 温度漂移：±200 ppm/℃ 的 TCR 在温度变化较大的场合会引起阻值偏移，若需高精度或低温漂，请考虑金属薄膜或低 TCR 器件。
- 焊接与回流：兼容无铅回流焊，但建议遵循 UNI-ROYAL 提供的回流曲线与峰值温度限制，避免超温或过多热循环。
- 机械应力：0201 为极小封装，贴装、波峰或回流过程中避免过大的机械挠曲与压力，以免发生焊接开裂或器件损伤。
- 清洗与储存：使用推荐溶剂清洗，存储环境避免潮湿与强污染，必要时进行干燥预处理。
六、包装与供应
- 常见包装形式为带卷（tape-and-reel），适用于自动贴片机。
- 如需大包装、样品或特殊筛选（如低温漂、筛选阻值等级等），建议与供应商或代理联系确认可用性与交货周期。
如需进一步的器件可靠性数据（如温升曲线、寿命测试、环境应力筛选结果）或具体回流焊工艺建议，可提供更多设计背景和应用条件，我可为您做更为针对性的选型与布局建议。
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