WMSIC Electronic Components

UNI-ROYAL 0402WGF1433TCE

Model0402WGF1433TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF1433TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF1433TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
143kΩ
Electronic Component
50
Electronic Component
BM0258833847
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF1433TCE 产品概述

一、产品简介

0402WGF1433TCE 是 UNI-ROYAL(厚声)品牌的一款高可靠性贴片厚膜电阻,额定阻值 143kΩ,精度 ±1%,额定功率 62.5mW。其超小型 0402 封装适用于空间受限的高密度板级设计,适配消费电子、通信模块、传感器及便携设备等应用场景,兼顾稳定性与可焊接性。

二、主要技术参数

  • 阻值:143kΩ
  • 精度:±1%(F)
  • 功率(额定):62.5mW(室温条件下)
  • 工作电压:50V(最大)
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 阻值类型:厚膜电阻
  • 封装:0402(公制 1005 英制)
  • 品牌:UNI-ROYAL(厚声)

三、产品特性与优势

  • 小型化设计:0402 封装极大节省 PCB 面积,适合高密度布线与多层板应用。
  • 高精度与稳定性:±1% 精度配合 ±100 ppm/℃ 的 TCR,可满足对阻值稳定性有中高要求的电路设计。
  • 宽温度适应:-55℃ 至 +155℃ 的耐温等级适应严苛环境与工业级应用。
  • 良好焊接性:厚膜材料与终端电镀工艺适配常见回流焊工艺,贴装可靠。
  • 可靠度高:厚膜工艺在应力与热循环下表现均衡,适合长期使用。

四、典型应用

  • 精密分压、偏置网络与滤波电路
  • 便携式消费电子(手机、可穿戴)阻抗匹配与偏置设计
  • 通讯设备与射频模块的直流偏置/反馈电阻(需注意功率与电压限制)
  • 传感器前端及模数转换输入网络

五、封装与机械说明

0402 封装体积小,适合自动贴片生产线。设计 PCB 拓扑时应考虑热量分布及邻近器件对散热的影响。推荐遵循厂商提供的封装尺寸与回流焊温度曲线,以保证焊接可靠性与阻值稳定性。

六、选型与使用建议

  • 功率裕量:额定功率 62.5mW,为保证可靠性,实际使用功耗应留出足够裕量(通常不超过额定的 50%~70%),并考虑热阻与 PCB 散热状况。
  • 电压限制:单个元件最大工作电压 50V,设计时应避免超过该值以免引起击穿或阻值漂移。
  • 温漂与精度:对于高精度测量电路,注意 ±100 ppm/℃ 的温漂对温度变化敏感度,必要时采用温度补偿或选用更低 TCR 的产品。
  • 贴装工艺:严格按回流曲线操作,避免重复高温循环;除湿处理与防潮包装可防止焊接缺陷。

七、可靠性与环境适应

0402WGF1433TCE 设计满足常见的环境可靠性要求,包括高低温循环、焊接热稳定性与机械震动冲击等。其材料和工艺适用于工业级温度范围,具体认证(如 AEC-Q 或 RoHS 等)请以厂方出具的检验报告为准。

总结:0402WGF1433TCE 以其超小封装、较高精度与宽温度适应性,适合空间受限且对阻值稳定性有中等要求的电子产品。选型时应综合考虑功率裕量、电压限制与工作环境,确保长期可靠运行。若需进一步的封装尺寸图、回流焊资料或认证文件,可向供应商索取详尽技术资料。

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