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1206W4J0201T5E 是 UNI-ROYAL(厚声)系列的一款厚膜贴片电阻,封装为1206,标称阻值 200Ω,精度 ±5%,额定功率 0.25W(250mW)。该器件适用于一般信号与低功率电路的表面贴装应用,具有尺寸稳定、成本低、可批量贴装的优点。
说明:按功率限制计算,在常温下该电阻因功耗而允许的最大端电压约为 V = √(P·R) = √(0.25×200) ≈ 7.07V;因此即使器件标称工作电压较高,设计时仍须以功率与热管理为主。
该厚膜电阻在室温(25℃)下额定功率为250mW。建议采用降额使用:在约70℃以上开始线性降额,至最高工作温度(155℃)时接近零输出功率,以保证长期可靠性。TCR ±100 ppm/°C 意味着温度每上升100℃阻值变化约1%,例如从25℃升至125℃时,200Ω大约变化2Ω。为防止热应力造成失效,应避免在高温条件下长期满载。
1206 封装适用于常规 SMT 回流焊工艺,兼容无铅和有铅回流曲线。焊接时应遵循元件厂或 PCB 工艺的回流温度和时间规范,避免多次高温循环和急冷急热导致的热机械疲劳。贴装时要保证焊盘对称,焊膏量适中,避免过多焊膏导致行程阻值漂移或器件错位。为减少机械应力,推荐在器件两端形成良好焊点并避免在器件上方直接敲击或弯折 PCB。
适用于消费类电子、通讯设备、家电控制板、仪器仪表中的分压、限流、上拉/下拉、电阻网络等低功耗场合。若电路对阻值稳定性和温漂有较高要求(例如精密测量、参考电路),建议选用低 TCR 的金属膜或薄膜电阻。
如需本型号的完整数据手册、回流焊建议曲线或样品支持,可提供具体需求,我可协助准备技术资料与选型对比。
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WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
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The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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