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UNI-ROYAL 1206W4J0332T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 1206W4J0332T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 1206W4J0332T5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.03g
- Electronic Component
- 3.3kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257342058
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W4J0332T5E 产品概述
一、产品简介
1206W4J0332T5E 是由 UNI‑ROYAL（厚声）出品的通用贴片厚膜电阻，封装规格为 1206（3216 metric）。该款电阻阻值为 3.3kΩ，公差 ±5%，额定功率 250mW，面向对成本、稳定性与可焊性有均衡要求的中低功率电子产品。
二、主要技术参数
- 电阻类型：厚膜电阻
- 阻值：3.3 kΩ
- 精度：±5%（J）
- 额定功率：250 mW
- 最高工作电压：200 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55 ℃ 至 +155 ℃
- 封装：1206（3216）贴片
- 品牌：UNI‑ROYAL（厚声）
三、电气性能与热特性
该型号采用厚膜工艺，具有良好的量产一致性和成本效益。±100 ppm/℃ 的温度系数适用于对阻值温漂有一般要求的电路；250 mW 的额定功率适合信号、分压、偏置等中低功率应用。注意在高温环境或受限散热的板上应进行功率降额处理，以保证长期可靠性。
四、封装、可焊性与可靠性
1206 封装便于自动贴装与回流焊接，兼容常规 SMT 工艺。厚膜材料在焊接和机械振动环境下表现稳定，适用于消费电子、工业控制等场景。常规注意事项包括避免长期超额功率和剧烈热冲击，良好 PCB 散热设计可延长使用寿命。
五、典型应用场景
- 信号调理与分压电路
- 上拉/下拉电阻、偏置网络
- 电源滤波与限流位（中低功率）
- 工业控制、家用电器与消费类电子的通用电阻需求
六、选型与使用建议
- 若电路对精度或温漂有更高要求，建议选用更低 TCR 或更高精度（±1%/±0.1%）的型号。
- 在高温环境或靠近热源处，应考虑功率降额或改用更大功率封装。
- 推荐按板级热仿真评估实际功耗与 PCB 温升，结合器件额定条件制定可靠的安全裕量。
- 采购买时确认包装形式与批号，便于生产一致性与可追溯性。
本产品面向需要经济性与可靠性平衡的常规电子设计，提供稳定的厚膜电阻特性和良好的 SMT 兼容性。若需更详细的可靠性试验数据、焊接规范或样品支持，可联系 UNI‑ROYAL（厚声）或其授权分销商获取完整数据手册。
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