Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 1206W4F3001T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 1206W4F3001T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 1206W4F3001T5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 3kΩ
- Electronic Component
- 1
- Electronic Component
- BM0209569223
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W4F3001T5E 产品概述
一、产品简介
1206W4F3001T5E 是 UNI-ROYAL（厚声）出品的一款 1206 封装贴片厚膜电阻器，标称阻值 3.00 kΩ，精度 ±1%，额定功率 1/4W（250 mW）。该器件适用于各种表面贴装（SMT）工艺，具有宽温度工作范围和良好的机械电气稳定性，常用于工业控制、通信设备、汽车电子和消费类电子等要求可靠性的场合。
二、主要电气参数
- 阻值：3.00 kΩ（3000 Ω）
- 精度：±1%
- 功率：250 mW（在环境温度 70°C 时额定）
- 最大工作电压：200 V
- 温度系数（TCR）：±100 ppm/°C
- 工作温度范围：-55°C ～ +155°C
- 电阻类型：厚膜电阻（SMD）
三、性能说明与计算示例
温度系数 ±100 ppm/°C 表示温度每变化 1°C，阻值理论上变化 0.01%。例如从 25°C 升至 85°C（ΔT=60°C），阻值变化约：3 kΩ × 100×10⁻⁶ × 60 ≈ 18 Ω（约 0.6%），对系统设计有参考意义。请在对精确阻值敏感的电路中考虑该温度漂移。
四、热特性与降额建议
额定功率 250 mW 通常以环境温度 70°C 作为参考。超过该温度时建议进行线性降额处理，直至在最高工作温度附近限制输出功率以保证长期可靠性。注意最大工作电压 200 V，不可超过该值以免引起击穿或过热。
五、封装与工艺建议
- 封装：1206（3216 英制/公制尺寸）
- 推荐采用标准 SMT 回流焊工艺，遵循焊料厂与 PCB 工艺规范。
- 焊接时注意控制峰值温度与停留时间，避免多次高温循环导致电阻漂移。
- PCB 焊盘设计请参考 1206 标准尺寸以保证焊接强度与热散逸。
六、典型应用场景
适用于分压、电压检测、限流、偏置与信号处理等场合，广泛用于消费电子、工业设备、通信基站、汽车电子（在满足汽车级验证要求时）及嵌入式系统。
七、可靠性与存储
厚膜工艺提供良好的机械抗振性能和长期稳定性。建议在干燥、防尘、防腐蚀环境下存储，避免潮湿与强酸碱气氛。出厂前应按照客户需求进行老化或筛选测试以满足特定应用的可靠性要求。
如需器件数据手册、安装建议图或大批量采购报价，请提供用途与数量，以便提供更针对性的技术支持与库存信息。
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