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UNI-ROYAL 0805W8J0302T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0805W8J0302T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0805W8J0302T5E
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.027g
- Electronic Component
- 3kΩ
- Electronic Component
- 1
- Electronic Component
- BM0228745307
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805W8J0302T5E 产品概述
一、产品简介
0805W8J0302T5E 为 UNI-ROYAL（厚声）系列贴片厚膜电阻，封装规格为 0805（2012英制）。标称阻值为 3.0kΩ，公差 ±5%（J 级），额定功率 125mW，适用于中小功率、密集布局的表面贴装电路。该器件以稳定的工艺和良好的批次一致性满足消费电子、通信和工业控制等领域对通用电阻的需求。
二、主要技术参数
- 电阻类型：厚膜贴片电阻（SMD）
- 标称阻值：3.0 kΩ
- 精度（公差）：±5%（J）
- 额定功率：125 mW（在规定散热条件下）
- 最高工作电压：150 V
- 温度系数（TCR）：±100 ppm/°C
- 工作温度范围：-55 ℃ 至 +155 ℃
- 封装尺寸：0805（2.0 mm × 1.25 mm）
三、产品特性与优势
- 体积小、密度高：0805 封装适合高密度 PCB 布局，节省空间。
- 良好的一致性与可焊性：厚膜工艺稳定，适配常见回流焊和波峰焊工艺。
- 宽工作温度：-55 ℃ 至 +155 ℃，适应严苛环境。
- 可靠的电气特性：±100 ppm/°C 的温度系数满足一般温漂要求；150 V 的工作电压覆盖多数低压电路。
四、典型应用场景
- 消费性电子：便携设备、电视、机顶盒等信号与电源分压。
- 通信设备：基站、路由器中的偏置、电流检测、终端匹配。
- 工业控制：传感器接口、测量电路、信号调理。
- 汽车电子（非关键安全回路）：在满足 AEC 要求前提下用于一般电子模块。
五、可靠性与环境适应性
该系列经过常规环境与机械可靠性试验（高低温循环、恒定湿热、温度冲击、机械冲击与振动、焊接耐热性），在额定条件下具有稳定的电阻漂移与低失效率。符合 RoHS 环保标准，适合无铅工艺制程。
六、封装与订购信息
- 封装：0805（卷带包装或托盘，适用于自动贴片机）
- 品牌：UNI-ROYAL（厚声）
- 型号示例：0805W8J0302T5E（用于订货与查找规格书，建议向供应商确认包装形式与最小订购量）
七、使用与焊接建议
- 推荐回流焊温度曲线与行业通用无铅工艺一致，避免长时间高温曝露以降低寿命退化。
- 在设计 PCB 时预留适当散热通道与焊盘尺寸，保证额定功率的散热条件。
- 对于对漂移敏感或关键精度场合，建议选择更低 TCR 或更高精度型号。
如需完整的技术规格书（含绝对最大额定值、长时漂移数据与可靠性试验报告），可提供具体需求以便获取原厂资料。
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