WMSIC Electronic Components

UNI-ROYAL 0402WGF5622TCE

Model0402WGF5622TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF5622TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF5622TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
56.2kΩ
Electronic Component
10
Electronic Component
BM0257243689
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF5622TCE 产品概述

一、产品简介

0402WGF5622TCE 为 UNI-ROYAL(厚声)出品的贴片厚膜固定电阻,标称阻值 56.2kΩ,精度 ±1%,封装为 0402(公制 1005)。该器件面向高密度表面贴装应用,尺寸小、可靠性高,适用于便携式电子、消费类产品及各种信号处理电路中的常用分流、分压与上/下拉场合。

二、主要性能参数

  • 阻值:56.2kΩ
  • 精度:±1%(F)
  • 功率额定:62.5mW(常温下)
  • 工作电压:50V(最大)
  • 温度系数(TCR):±100ppm/℃
  • 工作温度范围:-55℃ 至 +155℃
  • 结构类型:厚膜电阻(SMD)
  • 品牌:UNI-ROYAL(厚声)

三、特点与优势

  1. 小型化:0402 封装有利于高密度布局,节省 PCB 面积。
  2. 稳定性:厚膜工艺在常规环境下具有良好的长期稳定性和抗机械振动能力。
  3. 通用性强:56.2kΩ ±1% 在信号与偏置电路中常用,便于标准化设计与备料。
  4. 成本效益:厚膜电阻制造成本相对较低,适合大批量生产应用。

四、典型应用

  • 移动终端、电池管理和手持设备的偏置、分压网络。
  • 模拟前端的上/下拉电阻、分压取样。
  • 滤波、电平匹配以及信号耦合回路中的标准阻值元件。
  • 工业控制、家电电子与互联网终端等对体积和成本有要求的场合。

五、封装与焊接建议

  • 推荐按照制造商给出的 PCB land pattern 和回流焊工艺曲线进行装配,避免过高的焊接温度造成元件应力。
  • 0402 尺寸容易在回流过程中发生倾斜(tombstoning),建议对称布线与合适的焊盘设计以减小不均湿润效应。
  • 焊点应保证足够湿润与机械强度,避免过量焊膏导致短路或残留物影响性能。

六、可靠性与环境适应

  • 工作温度范围宽(-55℃~+155℃),适合大多数工业与消费环境。
  • 在高温或高湿环境下,应遵循器件的功率降额规则:为保证长期可靠性,建议实际工作功耗保留裕度(例如 <50% 额定功率),并避免靠近热源布局。
  • 厚膜电阻相较于金属膜电阻噪声略高,要求低噪声设计时应酌情选型。

七、选型与替代

  • 若需更低温漂或更高精度,可考虑金属膜或薄膜精密电阻(TCR 更低、精度可达 ±0.1%)。
  • 同规格替代品牌包括 Yageo、Vishay 等,可根据供应链与成本要求选择等效型号。
  • 订货时请确认完整料号、封装与包装方式(卷带、盘装等)以便生产配套。

以上为 0402WGF5622TCE 的产品概述。实际设计与生产应用请以厂商数据手册为准,必要时进行样机验证与可靠性测试。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.