WMSIC Electronic Components

UNI-ROYAL 0402WGF8202TCE

Model0402WGF8202TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF8202TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF8202TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
82kΩ
Electronic Component
10
Electronic Component
BM0257242576
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF8202TCE 产品概述

一、产品简介

0402WGF8202TCE 为 UNI-ROYAL(厚声)系列的贴片厚膜电阻,封装为 0402(约 1.0 mm × 0.5 mm)。标称阻值 82kΩ,公差 ±1%,标称功率 62.5 mW,额定工作电压 50 V,温度系数(TCR)±100 ppm/°C,工作温度范围 -55°C ~ +155°C。适用于体积受限的表面贴装电路,提供稳定的通用电阻解决方案。

二、主要参数

  • 阻值:82 kΩ
  • 精度:±1%(B 类)
  • 功率:62.5 mW(封装额定)
  • 最大工作电压:50 V
  • 温度系数:±100 ppm/°C
  • 工作温度:-55°C ~ +155°C
  • 封装:0402(1.0 × 0.5 mm,厚膜工艺)
  • 品牌:UNI-ROYAL(厚声)

三、主要特性

  • 紧凑封装,适合高密度 PCB 布局;
  • 厚膜工艺成本低,性能稳定;
  • ±1% 精度适合常规精密要求;
  • TCR ±100 ppm/°C,温漂中等,适合一般信号、偏置、电源分压等场合;
  • 宽温区工作能力,适应工业级温度环境。

四、典型应用

  • 信号处理电路、分压器与偏置网络;
  • 便携电子、消费类产品与工控模块;
  • 滤波、耦合及参考网络(非超高精度场合);
  • 高频/射频电路中作为阻抗或偏置元件(需注意自谐与寄生)。

五、焊接与使用建议

  • 推荐采用标准回流焊工艺,遵循元件供应商的温度曲线(峰值温度与时长按 JEDEC/供应商规范);
  • 考虑温度与功耗对寿命的影响,应对工作温度下进行功率降额设计;在高温环境下建议降低实际功耗以保证长期可靠性;
  • PCB 设计应保证良好散热路径并避免热应力集中,焊盘尺寸按 0402 推荐尺寸设计以利焊接质量;
  • 对焊接过程中化学残留、清洗及回流梯度敏感性做验证。

六、储存与包装

  • 常用为卷带(Tape & Reel)包装,适用于高速贴装机;
  • 建议常温、干燥、避免潮湿与酸性气体的环境储存,长期存放前可按照 IPC/JEDEC 建议做防潮处理。

七、选型与替代

  • 若需更低温漂可选金属膜或薄膜高精度系列;
  • 市场上等效封装和规格的产品可参考其他品牌 0402、82kΩ、±1% 的厚膜或薄膜型号,采购时注意功率、耐压及温漂一致性。

以上为 0402WGF8202TCE 的概述与使用建议,如需样片、详细规格书或回流曲线、环境应力测试数据,可进一步联系供应商索取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.