WMSIC Electronic Components

UNI-ROYAL 0805W8F390JT5E

Model0805W8F390JT5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8F390JT5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8F390JT5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
39Ω
Electronic Component
1
Electronic Component
BM0257342219
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8F390JT5E — UNI-ROYAL(厚声) 0805 39Ω ±1% 厚膜贴片电阻 产品概述

一、产品概述

0805W8F390JT5E 是 UNI-ROYAL(厚声)推出的一款高可靠性厚膜贴片电阻,封装尺寸 0805(2012 公制),标称阻值 39Ω,精度 ±1%。额定功率 125mW,工作电压可达 150V,温度系数(TCR)为 ±100ppm/℃,工作温度范围为 -55℃ 至 +155℃。此型号适用于通用电子产品以及对体积、性能有中高要求的电路设计。

二、主要特性

  • 厚膜工艺,成本与性能平衡,适合大批量制造与常规应用;
  • 0805 小型封装,利于高密度 PCB 设计与表贴自动化焊接;
  • 39Ω 阻值,±1% 精度满足滤波、分压、偏置等精确电路需求;
  • TCR ±100ppm/℃,在中等温度变化环境下具有良好稳定性;
  • 额定功率 125mW(典型评级),耐压最高 150V,适应多数低压到中压电路。

三、电气与环境参数

  • 阻值:39Ω;公差:±1%;
  • 功率:125mW(常温额定);建议在高温环境下按厂商给定的降额曲线使用;
  • 工作电压:150V(最大额定值);
  • 温度系数:±100ppm/℃,适合对温漂有一定要求的应用场景;
  • 工作温度:-55℃ 至 +155℃,可用于工业级温度范围的设备。

四、典型应用

  • 消费类电子:移动设备外围电路、音频电路、显示驱动等;
  • 通信设备:终端模块、放大器偏置、阻抗匹配网络;
  • 工业控制:传感器接口、信号调理、低功率电源分配;
  • 家电与仪器仪表:测量电路、保护与限流场合。

五、使用与注意事项

  • 热降额:在高于推荐环境温度时,应按厂商降额曲线线性降功率,避免长期满载工作;通常以 70℃ 为基准额定温度并向 155℃ 降额至零;
  • 焊接兼容性:适用于常规回流焊工艺,建议按照贴片元件回流曲线进行,可承受行业常见的回流温度峰值(具体温度与时间请参照 UNI-ROYAL 的工艺说明);
  • 安装注意:避免机械应力、在焊盘设计时留足焊接区域以防热应力导致裂纹;
  • 存储与搬运:保持干燥清洁环境,避免长时间潮湿或腐蚀性气体;推荐在常温下密封保存并按先入先出原则使用。

六、可靠性与质量保证

UNI-ROYAL(厚声)产品经过系统化的工艺控制与出厂测试,常见可靠性项目包括温度循环、高温加速、湿热、机械冲击与振动等。对于要求更高的应用,建议联系供应商索取详细的可靠性测试报告和产品规范书,以便在设计验证阶段进行对照验证。

总结:0805W8F390JT5E 以其紧凑的 0805 封装、±1% 的精度和工业级的温度范围,适合作为多类电子设备中精确、可靠的基本阻值元件。设计时请关注热降额与焊接条件,以确保长期稳定性与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.