Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 1206W4F1501T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 1206W4F1501T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 1206W4F1501T5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 1.5kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257341425
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W4F1501T5E 产品概述
一、产品简介
1206W4F1501T5E 是 UNI-ROYAL（厚声）出品的一款厚膜贴片电阻，封装为 1206（3.2 mm × 1.6 mm），阻值 1.5 kΩ，精度 ±1%，额定功率 250 mW。该元件适用于通用电子电路中的电压分压、限流、信号处理与偏置等场景，兼顾稳定性与成本效益。
二、主要电气参数
- 电阻类型：厚膜电阻
- 标称阻值：1.5 kΩ（1501）
- 精度：±1%（紧密公差，适合精密应用）
- 额定功率：250 mW（典型额定值，实际使用时需考虑环境温度下的降额）
- 最大工作电压：200 V
- 温度系数（TCR）：±100 ppm/℃（温度稳定性良好）
- 工作温度范围：-55 ℃ 至 +155 ℃
三、结构与封装
- 封装形式：1206（英制），尺寸约 3.2 mm × 1.6 mm。
- 制程：厚膜印刷电阻工艺，表面涂覆保护层，适配常规回流焊工艺。
- 推荐存放与搬运：避免受潮与机械冲击，静电防护常规处理即可。
四、性能特点与使用建议
- 精度与稳定性：±1% 精度配合 ±100 ppm/℃ 的温度系数，适合对阻值稳定性有中高要求的电路。
- 功率与热管理：250 mW 为典型额定功率，若工作环境温度高于 70 ℃ 或密集布板，应考虑热降额或增大焊盘散热面积以确保长期可靠性。
- 电压能力：最高工作电压 200 V，适合中低压应用；在高压脉冲或过压场景下应评估耐压裕量。
- 焊接兼容性：支持常规无铅回流焊（建议按 PCB 与元件热质量选择合适回流曲线，峰值温度参考 250–260 ℃，具体以厂商资料为准）。
五、典型应用场景
- 消费电子：电源分压、偏置电路、滤波网络。
- 工业与通讯设备：信号调理、采样电路、控制逻辑中限流/分压元件。
- 仪表与测量：作为精确分压或参考网络的通用电阻件（需结合电路整体温漂评估）。
备注：如需用于汽车级、医疗或航空等关键可靠性场合，请向供应商确认是否满足相应认证（如 AEC-Q200 等）以及提供完整的环境与寿命测试报告。购买与设计前建议索取完整数据手册以确认焊接曲线、热降额曲线及机械尺寸公差等详细信息。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
