WMSIC Electronic Components

UNI-ROYAL 0402WGF7501TCE

Model0402WGF7501TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF7501TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF7501TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
7.5kΩ
Electronic Component
10
Electronic Component
BM0257242483
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF7501TCE 产品概述

一、产品简介

0402WGF7501TCE 是 UNI-ROYAL(厚声)出品的一款贴片厚膜电阻,封装为0402(约1.0mm × 0.5mm),标称阻值 7.5kΩ,精度 ±1%,额定功率 62.5mW,额定工作电压 50V,温度系数(TCR)±100ppm/℃,工作温度范围 -55℃ ~ +155℃。定位为高密度PCB上通用的精密厚膜SMD电阻元件。

二、主要参数一览

  • 阻值:7.5kΩ
  • 精度:±1%
  • 功率:62.5mW(额定)
  • 额定工作电压:50V
  • 温度系数:±100ppm/℃(典型)
  • 工作温度:-55℃ ~ +155℃
  • 封装:0402(贴片)

三、特性与优势

  • 体积小、轻薄,适合高密度表贴组装与微型化产品设计;
  • 厚膜工艺成本优势明显,适合大批量生产;
  • ±1% 精度可满足一般精密分压、偏置及滤波网络要求;
  • 宽温区工作能力,适应工业级温度环境。

四、设计与使用注意事项

  • 功率与电压关系:使用时须考虑 P = V^2/R。以本器件为例,按额定功率计算允许最大持续电压 Vmax = √(P·R) = √(0.0625W × 7,500Ω) ≈ 21.6V。虽标注额定工作电压为 50V,但在 7.5kΩ 情况下若施加 50V,会导致功率远超额定值(≈333mW),造成元件损坏。设计时应以两者中更限制性的条件为准。
  • 温度系数影响:TCR ±100ppm/℃,举例从25℃升至100℃(ΔT=75℃)时阻值变化约 ±0.75%,与 ±1% 精度相叠加,须在系统容差内评估总误差。
  • 功率余量与降额:建议长期工作时采用降额策略(例如≤50%~70%额定功率)以提高可靠性与寿命,尤其在高温环境中更应保留裕量。
  • 焊接与机械应力:0402 尺寸较小,贴装与回流焊工艺需控制温度曲线与焊膏量,避免过热及强力刮擦导致开裂或焊点问题。

五、典型应用场景

  • 移动终端、可穿戴设备及消费类电子的分压、限流与偏置;
  • 通信设备、传感器前端的参考与阻抗匹配(在可接受TCR范围内);
  • 高密度电路板的通用精密电阻需求。

六、封装与生产建议

0402 小封装适配主流贴片机与回流焊流程,建议使用规范化的贴片布局、合适的焊盘尺寸与焊膏印刷,以降低焊接缺陷率。存储和运输注意防潮防压。

七、选型与采购建议

在选型时,请结合实际电压、功耗及温度变化评估工作点,若需在高电压或高功率工况下使用,应考虑更大功率或更高耐压的封装/型号。若需样品或批量采购,可向 UNI-ROYAL(厚声)或授权代理咨询器件可得性与可靠性试验数据。

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