Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0201WMF5900TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF5900TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF5900TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 590Ω
- Electronic Component
- 50
- Electronic Component
- BM0263574629
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF5900TEE 产品概述
一、产品简介
0201WMF5900TEE 为 UNI-ROYAL（厚声）出品的贴片厚膜电阻，阻值 590Ω，精度 ±1%，额定功率 50mW，适用于超小型、高密度 PCB 设计。厚膜工艺兼顾成本与稳定性，适合各类消费电子与便携设备的精密偏置与限流场景。
二、主要特性
- 阻值：590Ω，公差 ±1%。
- 功率：50mW（额定）；工作电压：25V。
- 温度系数（TCR）：±200 ppm/℃，在宽温区间保持良好一致性。
- 工作温度范围：-55℃ 至 +155℃，满足严苛环境要求。
- 小尺寸封装：0201（约 0.6mm × 0.3mm），有利于高密度布局与轻薄化产品。
三、典型应用
适用于智能手机、可穿戴设备、无线通讯模块、精密模拟电路的偏置/限流、电平匹配、阻抗调节及微功率传感电路等需要小封装与中等精度的场合。
四、电气与环境参数
该器件在额定条件下工作稳定，TCR ±200 ppm/℃ 说明在温度波动时阻值漂移受控。推荐在 PCB 设计时考虑功率降额与热散逸，遵循厂商提供的功率-温度降额曲线以保证长期可靠性。
五、封装与外形
0201 超小封装便于实现高密度 SMT 装配，尺寸约 0.6mm × 0.3mm（请以具体器件图纸为准）。表面涂覆适合常规回流焊工艺，兼容自动贴装与高速回流生产线。
六、使用建议与可靠性
- 焊接：遵循推荐回流温度曲线，避免过冲以防封装和内部应力损伤。
- 储存与装配：避免潮湿、强酸强碱和机械应力；贴装时遵循 ESD 防护规范。
- 设计注意：在高环境温度或高占空比工作情况下，应考虑功率降额并预留热裕量。
UNI-ROYAL 品牌在厚膜电阻领域具有成熟产能与稳定品质，可为大批量生产提供一致性支持。若需详细曲线、尺寸图或可靠性测试报告，请联系供应商索取产品技术文档。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
