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UNI-ROYAL 0805W8F750JT5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0805W8F750JT5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0805W8F750JT5E
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.027g
- Electronic Component
- 75Ω
- Electronic Component
- 1
- Electronic Component
- BM0227584858
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805W8F750JT5E 产品概述
一、产品简介
0805W8F750JT5E 是 UNI-ROYAL（厚声）出品的一款厚膜贴片电阻，封装为 0805（公制 2012，约 2.0 × 1.25 mm）。标称阻值 75 Ω，精度 ±1%，额定功率 125 mW。该系列器件针对通用电子产品的表面贴装应用设计，兼顾稳定性与成本效益，适用于密度较高的 PCB 布局与批量自动贴装生产。
二、主要性能参数
- 电阻类型：厚膜电阻（SMD）
- 阻值：75 Ω
- 精度：±1%
- 额定功率：125 mW
- 工作电压：150 V（最大）
- 温度系数（TCR）：±200 ppm/℃
- 工作温度范围：-55 ℃ ~ +155 ℃
- 封装：0805（2012）贴片
三、主要特点
- 稳定的电阻性能：厚膜工艺保证在常用环境下阻值稳定，长期漂移小，适合一般模拟与数字电路应用。
- 精度较高：±1% 精度适用于对阻值有一定要求的分压、偏置、限流等场合。
- 小型封装：0805 封装利于提高 PCB 集成度，支持自动贴装与回流焊流程，便于量产。
- 宽温度范围：-55 ℃ 至 +155 ℃，适应工业级环境温度要求。
- 额定工作电压与功率满足多类低功耗信号与电源电路需求。
四、典型应用场景
- 信号调理、偏置与分压网络
- 模拟电路与数字电路中的限流电阻
- 通信设备、工业控制、仪器仪表等中需稳定阻值的场合
- 消费电子产品中的贴片式阻值元件
五、包装与封装说明
0805W8F750JT5E 采用 0805 标准 SMD 封装，适合贴片机高速贴装。具体包装形式（卷带、盘带等）请依照供应商订购单或数据表确认，以便与 SMT 产线匹配。
六、使用与焊接建议
- 使用常规回流焊工艺进行焊接时，请参考厂商提供的焊接曲线与湿热循环规范，以避免过热导致性能变化。
- 布线与焊盘设计应考虑热量分散，过大的铜箔面积会降低元件的实际可承受功率；在高功耗应用中应做好热管理与功率降额处理。
- 避免在贴装与回流过程中对元件施加过大弯曲或机械应力，避免影响接触和长期可靠性。
- 储存与搬运过程中注意防潮、防污染及防静电。
七、可靠性与质量控制
该厚膜电阻经过常规批量测试与老化筛选，满足行业一般可靠性要求。适用于需要长期稳定性的商业及工业类应用。具体可靠性测试（如温度循环、湿热、机械冲击等）和寿命评估数据，请参考 UNI-ROYAL 的详细数据手册或向供应渠道索取认证报告。
八、订购与注意事项
在采购前请确认所需阻值、精度与封装与电路设计相符；若电路中存在高频、低噪或严格温漂要求，可考虑更低 TCR 或金属膜/薄膜电阻替代。对于特殊环境或关键应用建议索取样品并做实际电路验证。详细规格、封装图片、回流焊曲线及包装信息，请向 UNI-ROYAL 正规代理或总代理获取产品数据手册（PDS）以便落地应用。
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