WMSIC Electronic Components

UNI-ROYAL 0603WAF4991T5E

Model0603WAF4991T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF4991T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF4991T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
4.99kΩ
Electronic Component
1
Electronic Component
BM0257245557
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF4991T5E 产品概述

一、产品简介

0603WAF4991T5E 是 UNI-ROYAL(厚声)出品的一款厚膜贴片电阻,封装尺寸为 0603(1608公制)。标称阻值为 4.99 kΩ,精度 ±1%,额定功率 100 mW,适用于对体积、成本和稳定性有综合要求的表面贴装电路。

二、主要参数

  • 电阻类型:厚膜电阻
  • 阻值:4.99 kΩ
  • 精度:±1%(1/100)
  • 额定功率:100 mW(环境温度下)
  • 最大工作电压:75 V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55 ℃ 至 +155 ℃
  • 封装:0603(英制0603)
  • 品牌:UNI-ROYAL(厚声)

三、产品特点与优势

  • 体积小,适合高密度贴片设计与空间受限的应用场景。
  • ±1% 精度与 ±100 ppm/℃ 的温漂,使其在一般模拟与数字电路中具有可靠的阻值稳定性。
  • 厚膜工艺成本效益高,批量一致性好,满足大规模生产需求。
  • 最大工作电压 75 V,适合中低压电路应用,同时在额定功率范围内表现稳定。

四、典型应用场景

  • 移动通讯、消费类电子产品的分压、偏置与限流电路。
  • 仪表与测控设备的非关键精密分路(需配合温漂与精度要求评估)。
  • 工业控制板、汽车电子(非关键安全回路)以及其它需要小封装与批量化的嵌入式系统。

五、封装与装配建议

  • 0603 封装适配自动化贴装与回流焊工艺。建议按照制造商提供的回流曲线与温度限制进行焊接,以保证长期可靠性。
  • 在实际设计中,应考虑功率降额与热散逸条件:在较高环境温度或热密集区域,需采取降额或散热措施以避免过热导致寿命降低。
  • 推荐在 PCB 布局时为电阻预留合适的焊盘,并避免紧邻高温发热元件。

六、可靠性与测试

UNI-ROYAL 的厚膜贴片电阻通常通过常规的机械与环境可靠性测试,包括温度循环、湿热、焊接耐受性和振动测试等。对于关键应用,建议根据应用场景与可靠性需求,参照厂方数据手册进一步确认具体的可靠性指标与使用条件。

如需更详细的电气特性曲线、回流焊规范或订购包装信息(卷带规格、最小包装量等),建议联系供应商索取 0603WAF4991T5E 的完整规格书。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.