WMSIC Electronic Components

UNI-ROYAL 0603WAF1303T5E

Model0603WAF1303T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF1303T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF1303T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
130kΩ
Electronic Component
10
Electronic Component
BM0257245694
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF1303T5E 产品概述

一、产品简介

0603WAF1303T5E 是 UNI-ROYAL(厚声)出品的一款贴片厚膜电阻,封装为 0603(1608公制),标称阻值 130kΩ,精度 ±1%。此系列以体积小、成本低、批量一致性好为特点,适合表面贴装(SMT)工艺,面向一般电子产品的阻值分流、偏置与分压等应用场景。

二、主要电气与热学参数

  • 阻值:130kΩ(代码“1303”表示 130×10^3 Ω)
  • 精度:±1%
  • 功率额定:100 mW(贴片 0603 尺寸的典型额定功率)
  • 最高工作电压:75 V
  • 温度系数(TCR):±100 ppm/℃(典型厚膜电阻水平)
  • 工作温度范围:-55 ℃ ~ +155 ℃

三、结构与工艺特点

采用厚膜薄膜工艺在氧化铝基板上喷墨或丝网印刷沉积电阻层,经过烧结与端电极处理后形成最终电阻单元。厚膜工艺相较于金属薄膜在成本与高阻值范围(如 130kΩ)上更具优势,同时提供满足一般工业级环境的稳定性。

四、应用建议

适用于:

  • 电源偏置、上拉/下拉电阻与高阻值分压网络;
  • 信号处理前端、放大器偏置与滤波回路的阻值元件(在 ±1% 精度与 ±100 ppm/℃ TCR 可接受范围内);
  • 通信、消费电子、仪表与工业控制等需要体积小且阻值较大器件的场合。

不推荐用于对温漂或长期稳定性有极高要求的精密测量或参考电阻场合,应考虑金属膜或薄膜高精度产品。

五、封装、焊接与可靠性提示

  • 0603 封装适配常规贴片机与回流焊工艺;建议按照制造商提供的回流温度曲线进行焊接,避免超过元件允许的峰值温度及过长热循环,以防电阻参数漂移。
  • 在高温环境下需根据供应商的功率降额曲线进行使用,避免长期在额定功率附近工作以延长寿命。
  • 储存与搬运遵循普通贴片元件规范,避免强力弯折与机械冲击。出货通常为卷带(请向供应商确认包装形式与批号),便于 SMT 贴装线使用。

六、选型要点与检验建议

  • 确认工作电压与最大额定电压(75 V)是否满足电路实际需求,避免在高阻值下产生过大电压导致绝缘或击穿问题。
  • 若电路对温度系数或长期漂移敏感,应对比 ±100 ppm/℃ 与目标指标,必要时选择更低 TCR 的品种。
  • 建议在样机阶段进行温度循环与功率应力测试,验证在目标环境下的阻值稳定性与可靠性。

七、采购与技术支持

订购时请确认完整料号、包装方式(卷带/盘装)及检验要求。若需材料合规(如 RoHS)或特定可靠性认证(如 AEC-Q)、以及更详细的焊接曲线与功率降额图,请联系供应商或代理获取技术资料与检测试验报告。

总结:0603WAF1303T5E 为一款面向通用电子应用的 0603 厚膜贴片电阻,130kΩ/±1% 的参数组合在体积与成本受限的设计中提供了较好的可用性,适合多种常见偏置与高阻值场合。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.