WMSIC Electronic Components

UNI-ROYAL 0402WGF6492TCE

Model0402WGF6492TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF6492TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF6492TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
64.9kΩ
Electronic Component
50
Electronic Component
BM0263477321
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF6492TCE厚膜贴片电阻产品概述

0402WGF6492TCE是UNI-ROYAL(厚声)推出的小型化厚膜贴片电阻,针对高密度PCB设计场景优化,平衡了阻值精度、功率密度与宽温适应性,适用于工业控制、便携式电子等多类终端产品。

一、核心定位与基础属性

该电阻属于厚膜电阻系列,采用0402(英制)/1005(公制)封装,核心定位为中精度、低功耗、宽温型贴片电阻,满足电子设备小型化趋势下的性能需求,同时通过成熟的厚膜工艺控制成本,适合量产应用。

二、关键参数深度解析

以下参数为选型核心参考,直接关联电路性能:

  1. 阻值与精度:标称阻值64.9kΩ(对应4位代码6492,即649×10²Ω),精度±1%——可满足大多数信号滤波、分压、限流电路的偏差要求,避免因阻值误差导致的信号失真或控制精度下降。
  2. 功率与电压限制:最大额定功率62.5mW,最大工作电压50V——需注意电路中实际功耗需低于额定功率(计算方式:实际功耗=I²R≤62.5mW,或V≤50V),避免过热或击穿。
  3. 温度系数与工作范围:温度系数±100ppm/℃,工作温度-55℃+155℃——温度变化100℃时,阻值漂移仅±0.1%,宽温范围覆盖工业级(-40℃+85℃)、汽车级部分场景,极端温度下性能稳定。

三、封装与制造工艺

  1. 封装尺寸:0402封装(尺寸约1.0mm×0.5mm×0.3mm)——是贴片电阻的主流小型化封装之一,可显著节省PCB空间,适配手机、智能穿戴等紧凑设计。
  2. 厚膜工艺优势:采用陶瓷基底+丝网印刷电阻浆料+烧结工艺制造,相比薄膜电阻成本更低,且具备良好的长期稳定性;表面覆盖保护层,提升抗湿性与机械强度。
  3. 品牌背书:UNI-ROYAL(厚声)是国内电阻制造龙头企业,产品符合IEC 60115、JIS C 5201等行业标准,一致性与可靠性经批量验证。

四、典型应用场景

结合参数特性,该电阻适用于以下场景:

  1. 便携式电子设备:手机主板、智能手环、蓝牙耳机等——0402封装节省空间,低功耗适配电池供电电路,±1%精度保证信号处理准确。
  2. 工业控制模块:PLC输入输出模块、传感器信号调理电路等——宽温范围(-55℃~+155℃)满足工业现场高温/低温环境,阻值稳定不影响控制逻辑。
  3. 消费电子配件:充电器、移动电源、智能音箱等——厚膜工艺成本可控,耐焊接与抗振动性能适配量产组装。
  4. 物联网终端:低功耗传感器节点、智能家居设备等——低功率与小型化特性,契合物联网设备“小尺寸、低功耗”的设计需求。

五、可靠性与环境适应性

  1. 温度稳定性:±100ppm/℃的温度系数,在工作温度范围内阻值漂移极小,避免因环境温度变化导致电路参数偏移。
  2. 耐环境性能:通过湿度测试(IEC 60068-2-67)、温度循环测试(-55℃~+155℃循环),可适应潮湿、高低温交替的复杂环境。
  3. 长期可靠性:负载寿命测试(LTS)满足1000小时以上阻值变化≤0.5%,焊接后阻值无明显漂移,适合长期稳定运行的电子设备。

六、选型注意事项

  1. 功率与电压匹配:实际电路中需严格控制功耗≤62.5mW,电压≤50V(以较低者为准),避免过载损坏。
  2. 焊接工艺:0402封装需采用回流焊工艺,温度曲线需符合IPC J-STD-020标准,避免过热导致电阻开裂。
  3. 静电防护:贴片电阻为静电敏感元件,生产/组装过程中需佩戴ESD手环,使用防静电工具。

该电阻通过平衡尺寸、性能与成本,成为中低端到中端电子设备的实用选型,适合对精度、温度适应性有一定要求但预算有限的应用场景。

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