WMSIC Electronic Components

UNI-ROYAL 0402WGF3002TCE

Model0402WGF3002TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF3002TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF3002TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
30kΩ
Electronic Component
10
Electronic Component
BM0257242468
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF3002TCE 产品概述

一 产品简介

0402WGF3002TCE 是 UNI-ROYAL(厚声)出品的一款0402封装厚膜贴片电阻,标称阻值为 30kΩ,精度±1%。该器件适用于要求体积小、精度较高且成本敏感的消费电子、移动设备与工控领域。

二 主要参数

  • 阻值:30kΩ
  • 精度:±1%(1/100)
  • 功率:62.5mW(封装额定)
  • 工作电压:50V
  • 温度系数(TCR):±100ppm/℃
  • 工作温度范围:-55℃ 至 +155℃
  • 封装:0402(公制1005)
  • 类型:厚膜电阻

三 特性与优势

  • 小封装(0402),适合高密度贴装与微型化设计。
  • ±1% 精度满足多数滤波、分压与偏置网络需求。
  • ±100ppm/℃ 的温漂在一般消费级与工业级应用中表现稳定。
  • 工作温度范围宽,能适应较苛刻环境。
  • UNI-ROYAL 品牌具有成熟的制造工艺与良好的一致性控制。

四 典型应用场景

  • 移动终端、可穿戴设备的分压与偏置网络。
  • 电池管理、电源监控中的反馈与检测回路。
  • 信号调理、RC时间常数设置与滤波电路。
  • 工业控制与传感器接口(在满足功耗与温漂要求的前提下)。

五 选型与注意事项

  • 由于封装与面积限制,62.5mW 为典型额定功率,高功耗场合需重新选型或并联/外扩散热处理。
  • 在超过常温工况时,请参照厂方功率降额曲线进行热设计。
  • 若电压瞬变较大,确认最大工作电压与脉冲能力是否满足系统需求。
  • 对温漂或长期稳定性有更高要求时,可考虑精密薄膜电阻或更低TCR等级的零件。

六 焊接与存储建议

  • 建议采用符合JEDEC的回流焊工艺,峰值温度与时间按制造商推荐曲线控制。
  • 存储避免潮湿、高温与酸碱性环境,若为防潮包装打开后建议在规定时间内使用完毕。

七 包装与订购信息

  • 型号:0402WGF3002TCE;品牌:UNI-ROYAL(厚声)。
  • 常见卷带包装,具体数量与交付周期请参考供货商库存与报价。

该产品适合对体积与成本敏感且对温漂、精度有中等要求的电子设计。如需更高精度或更大功率选型,可提供替代建议与对比参数。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.