WMSIC Electronic Components

UNI-ROYAL 0805W8F2200T5E

Model0805W8F2200T5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8F2200T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8F2200T5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
220Ω
Electronic Component
1
Electronic Component
BM0257245282
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8F2200T5E — UNI-ROYAL(厚声) 0805 220Ω ±1% 厚膜贴片电阻 产品概述

一、产品简介

0805W8F2200T5E 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,封装规格为 0805(公制约 2.0 × 1.25 mm)。标称阻值 220Ω,精度 ±1%,额定功率 125 mW,工作电压上限 150 V,温度系数(TCR)典型值 ±100 ppm/℃,工作温度范围 -55℃ 至 +155℃。该型号适用于自动贴片生产线,提供稳定的电阻特性与良好的可焊性,适合多种电子设备的可靠小尺寸电阻需求。

二、主要性能特点

  • 稳定性高:厚膜工艺在常温及典型湿热条件下表现出良好的阻值稳定性,公差 ±1% 适合精度较高的电路设计。
  • 宽温度适应性:-55℃ 至 +155℃ 的工作温度范围,适合工业级及消费电子长期使用。
  • 低噪声、良好机械强度:厚膜结构兼顾电气性能与抗机械应力能力。
  • 兼容表面贴装工艺:支持常见回流焊接流程,适合自动化组装与潮湿封装要求(详见厂商回流曲线与焊接注意事项)。

三、典型电气参数

  • 阻值:220 Ω
  • 精度:±1%(F)
  • 额定功率:125 mW(基于参考环境温度,实际应按厂商功率降额曲线使用)
  • 最高工作电压:150 V
  • 温度系数:±100 ppm/℃
  • 环境温度范围:-55℃ ~ +155℃

四、应用场景

  • 通用电子设备电阻网络、分压器、基准电阻应用;
  • 信号链与测量电路中作为精密限流或负载元件;
  • 消费类产品(家电、移动设备)、工业控制、通信设备及测试仪器等需要小型化与高可靠性的场合;
  • LED 驱动限流、电平匹配及上拉/下拉电阻应用(需注意功率与热量分配)。

五、使用建议与可靠性

  • 焊接:建议遵循厂商推荐的回流焊温度曲线,通常兼容常见无铅回流工艺;避免重复高温暴露造成阻值漂移。
  • 功率降额:在高环境温度下应进行功率降额设计,避免在高温区间长期满载运行,参照供应商提供的降额特性曲线。
  • PCB 布局:采用规范的贴片焊盘与热释散设计,保持良好焊点以利散热与机械固定;避免在元件正下方开大量通孔导致应力集中。
  • 贮存与搬运:避免潮湿、高温及腐蚀性气体环境,贴片盘或卷带包装应密封保存,防止氧化或受潮影响焊接性能。
  • 可靠性验证:建议在产品导入阶段完成环境试验(温循环、湿热、焊接热冲击)以确认整体可靠性。

六、包装与选型建议

0805W8F2200T5E 常见以卷带(Tape & Reel)方式提供,便于 SMT 自动化贴装。选型时注意与电路板热管理、功耗预算及工作环境相匹配;若需更高功率或更低 TCR,可考虑更大封装或薄膜/金属膜系列产品。欲获得详细回流曲线、功率降额表与可靠性数据,请索取 UNI-ROYAL 官方数据手册以便准确设计与验证。

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