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UNI-ROYAL 0805W8F1503T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0805W8F1503T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0805W8F1503T5E
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.027g
- Electronic Component
- 150kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257245569
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805W8F1503T5E 产品概述
一、产品简介
0805W8F1503T5E 是 UNI-ROYAL（厚声）推出的一款贴片厚膜电阻，阻值 150kΩ，精度 ±1%，封装为常用的 0805（2012 英制）规格。该产品针对体积受限且要求较高精度与温度稳定性的电子设计场景，提供可靠的连续性与可重复性性能，适合批量生产的 SMT 工艺。
二、主要性能参数
- 电阻类型：厚膜电阻（Thick Film）
- 标称阻值：150kΩ
- 精度（容差）：±1%（F 级）
- 功率额定值：0.125W（125mW）
- 最高工作电压：150V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：0805（2012）贴片
三、产品特点
- 高精度：±1% 容差适用于对阻值要求较严格的模拟与精密分压场合。
- 良好温度稳定性：±100 ppm/℃ 的温度系数，可在宽温区间维持较稳定阻值表现。
- 紧凑封装：0805 尺寸兼顾体积与可靠性，便于高密度 PCB 布局。
- 适用 SMT 工艺：兼容回流焊贴装流程，便于自动化贴装与波峰/回流焊接生产。
- 宽温工作范围：-55℃ ~ +155℃，适应工业级环境。
四、典型应用
- 模拟信号处理电路中的偏置、阻抗匹配与反馈网络；
- 电压分压与检测电路；
- 通信与消费电子产品的常规限流与阻抗控制；
- 工业控制、仪表与车载电子（需根据整机认证确认）等对可靠性有要求的场合。
五、封装与安装注意
0805（2.0 × 1.25 mm）封装便于在常见 SMT 贴装设备上实现高产能加工。建议按常规回流焊曲线进行焊接，避免长期超过额定功率和额定工作电压，以防电阻因过热或过压导致漂移或失效。焊盘设计与清洗工艺需符合厚膜电阻的常规要求，避免机械应力集中。
六、可靠性与环境适应性
该型号在-55℃至+155℃范围内工作，适应工业温度等级。厚膜工艺在热循环、机械振动和湿热环境下表现稳定，长期漂移小。对于关键应用建议依据具体应用场景进行额外的寿命与环境测试验证。
七、使用与存储注意事项
- 使用时应确保实际电功率小于额定 125mW，留有安全裕量；
- 最大工作电压不得超出 150V；
- 存储在干燥、恒温环境，避免潮湿与腐蚀性气体；
- 在强机械振动或多次冲击环境中应注意 PCB 固定与封装保护，防止焊点或元件破裂。
八、订购信息与包装
品牌：UNI-ROYAL（厚声）；型号：0805W8F1503T5E。常见为卷带（Tape & Reel）供货，适合自动贴装生产。订购时请确认阻值、容差、封装及批量需求，必要时可向供应商索取详细的规格书（Datasheet）与可靠性测试报告，以便于在设计与量产阶段进行验证。
如需针对特定应用的等效电阻推荐、热功率估算或 PCB 布局建议，可提供电路环境信息，我可以协助进一步评估与选型。
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