WMSIC Electronic Components

UNI-ROYAL 1206W4J0330T5E

Model1206W4J0330T5E
Package1206
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 1206W4J0330T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
1206W4J0330T5E
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.03g
Electronic Component
33Ω
Electronic Component
1
Electronic Component
BM0257624855
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1206W4J0330T5E 产品概述

一、产品简介

1206W4J0330T5E 是 UNI-ROYAL(厚声)系列的一款厚膜贴片电阻,封装为 1206(公制 3216),标称阻值 33Ω,精度 ±5%,额定功率 1/4W(250mW),温度系数(TCR)±100ppm/℃,工作温度范围 -55℃ ~ +155℃。此型号为通用型表面贴装电阻,适用于批量 SMT 贴装与自动化生产。

二、主要规格速览

  • 阻值:33Ω ±5%
  • 封装:1206(3216)
  • 额定功率:0.25W(250mW)
  • 额定工作电压:200V(器件耐压)
  • 线性温度系数:±100ppm/℃(典型为厚膜特性)
  • 工作温度:-55℃ ~ +155℃
  • 工艺类型:厚膜电阻

注:器件额定工作电压 200V 表示器件在规定环境下的耐压能力,但在实际电路中需同时考虑功率限制。基于额定功率计算的最大允许电压与电流为:Vmax = sqrt(P·R) ≈ √(0.25×33) ≈ 2.87V;Imax = sqrt(P/R) ≈ 0.087A(约 87mA)。超过此电压/电流会导致功率过载而损坏器件。

三、性能特点

  • 稳定的厚膜工艺,适合大批量成本敏感型应用。
  • ±5% 精度满足一般模拟、数字及分压电路需求。
  • ±100ppm/℃ 的 TCR 对温度敏感度有限制,适用于对温漂不是极端苛刻的场合。
  • 宽温度范围适应工业级环境。
  • 标准 1206 封装兼容市面大多数贴片机和回流工艺,便于生产线集成。

四、典型应用场景

  • 常规分压、偏置网络与拉低/拉高电阻
  • LED 限流(需注意功率与电压限制)
  • 模拟/数字接口的终端或阻抗匹配(非精密感应)
  • 工业与家电类电子产品的通用电阻需求
  • 自动化贴片生产环境中的标准物料替换件

五、使用建议与注意事项

  • 严格遵守功率限制:在实际布局时以额定功率和散热条件为准,环境温度升高会降低允许的耗散功率,应参考厂方降功率曲线进行设计。
  • 电压与电流限制:尽管器件标称工作电压 200V,但因阻值与功率关系,实际上跨阻器件上的允许电压受功率限制(约 2.87V)。高压应用请改用更高阻值或额定功率更大的器件设计。
  • 焊接与回流:1206 封装兼容常见回流焊工艺。为保证可靠性,请参考 UNI-ROYAL 的官方焊接曲线与回流温度上限。
  • 储存与搬运:避免高湿高温环境,ESD 管理按常规元器件处理即可。贴片在长期储存或施工中建议使用原厂封装和吸湿封装(若有)。
  • 如需更严格的电阻精度、低 TCR 或高功率,请咨询厂方或选择金属膜/金属薄膜等更高性能系列。

六、包装与采购建议

该型号常用于 SMT 大批量贴片,建议以卷带(tape-and-reel)形式采购以提高贴装效率。采购时请向供应商确认包装规格、出货检验报告(RoHS/物料证书)及完整数据手册,以便获取详细的机械图、温度功率降额曲线和焊接规范。

如需更详细的电气特性、可靠性试验数据或定制化要求,建议直接咨询 UNI-ROYAL(厚声)或其授权分销商获取官方资料与技术支持。

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