WMSIC Electronic Components

UNI-ROYAL 0201WMF1000TEE

Model0201WMF1000TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF1000TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF1000TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
100Ω
Electronic Component
10
Electronic Component
BM0230266538
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF1000TEE 产品概述

一、产品简介

0201WMF1000TEE 是 UNI-ROYAL(厚声)推出的一款微型贴片厚膜电阻,阻值100Ω,精度±1%。采用0201超小封装,适合高密度、轻薄化电路板设计,在移动终端、可穿戴设备、物联网节点及各类精密电子模块中广泛应用。

二、主要特性

  • 阻值:100Ω,公差±1%,满足中高精度电阻需求。
  • 功率额定:50mW,适用于低功耗信号和偏置电路。
  • 工作电压标称:25V(产品耐压限定),但根据功率与阻值计算,连续跨端电压不应超过约2.24V(sqrt(P·R)),以避免超过额定功耗。
  • 温度系数(TCR):±200ppm/℃,温度漂移可控,适合对温漂有一定要求的应用。
  • 工作温度范围:-55℃ ~ +155℃,可满足广泛环境下的可靠性要求。

三、技术参数(要点)

  • 类型:厚膜电阻(贴片)
  • 阻值与公差:100Ω ±1%
  • 额定功耗:50mW(室温条件下)
  • 最高工作电压:25V(参考)
  • TCR:±200ppm/℃
  • 环境温度范围:-55℃ ~ +155℃
  • 品牌:UNI-ROYAL(厚声)
  • 型号:0201WMF1000TEE

四、封装与安装建议

  • 封装:0201(约0.6mm × 0.3mm,常见公制/英制0201尺寸),便于高密度布局。
  • 制程兼容:支持无铅回流焊工艺,请按PCB制造商与贴片元件回流曲线规范操作(短时最高温度通常不超过260℃)。
  • 贴装注意:因体积极小,推荐采用精密取放与视觉对位设备;焊盘设计需考虑焊膏量与热分布,避免偏位或焊接缺陷。
  • 功率降额:在高温环境下应按照厂商降额曲线进行设计,保证长时间稳定运行。

五、适用场景与选型建议

  • 适用:移动终端、蓝牙/无线模块、传感器前端、信号调理、分压器、拉/下拉电阻等低功耗电路。
  • 选型提示:当电路存在较大电压或功耗条件时,应根据P=V^2/R计算实际功耗并选用更大功率或更高阻值方案;若对温度漂移或精度要求更高,可考虑更低TCR或更高精度(±0.1%)的器件。

六、可靠性与存储

  • 长期存储建议保持干燥、避免强光与腐蚀性气体,防潮包装(密封盘带或防潮袋)有助于良好的焊接性能。
  • 在设计中遵循热管理与电气应力限制,能显著提升使用寿命与可靠性。

0201WMF1000TEE 以其微小封装与稳定电性能,为追求极致尺寸与可靠性的电子产品提供了可靠的电阻解决方案。选型时请结合实际电压、功率与环境工况,确保器件在安全工作区内运行。

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