WMSIC Electronic Components

UNI-ROYAL 0201WMJ0152TEE

Model0201WMJ0152TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMJ0152TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMJ0152TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
1.5kΩ
Electronic Component
10
Electronic Component
BM0263574715
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMJ0152TEE 产品概述

一、产品简介

0201WMJ0152TEE 是 UNI-ROYAL(厚声)出品的一款贴片厚膜电阻,阻值为 1.5kΩ,阻值公差 ±5%,额定功率 50mW,常用于超小型高密度电路板。封装为 0201(典型尺寸约 0.6mm × 0.3mm),适合要求微小体积与批量表贴的消费类与便携式电子产品。

二、主要技术参数

  • 电阻类型:厚膜电阻
  • 阻值:1.5kΩ
  • 精度:±5%
  • 额定功率:50mW
  • 最高工作电压:25V
  • 温度系数(TCR):±200ppm/℃
  • 工作温度:-55℃ ~ +155℃
  • 封装:0201(贴片)
  • 品牌:UNI-ROYAL(厚声)
    产品编号:0201WMJ0152TEE

三、产品特点

  • 体积极小,适合高密度贴装与空间受限的 PCB 设计。
  • 厚膜工艺成本效益高,适合大批量生产。
  • 宽工作温度范围(-55℃ 至 +155℃),满足一般工业级环境要求。
  • TCR ±200ppm/℃,在多数低频、低精度场合具有稳定性。
  • 额定功率 50mW,与 0201 尺寸匹配,适用于低功耗分流、偏置与信号匹配电路。

四、典型应用

  • 手机、平板、可穿戴设备等便携式电子终端的空间受限电路。
  • 耗材电子、传感器接口、滤波与偏置网络。
  • 工业控制与消费电子中的一般用途电阻(非高精度要求场合)。
  • 大批量成本敏感型产品的 BOM 选择。

五、可靠性与加工建议

  • 建议按常规回流焊工艺贴装,遵循 PCB 装配与回流温度曲线的行业规范以避免热应力。
  • 0201 封装尺寸较小,贴片、回流与检测工序需使用精密设备与良好可视化对位。
  • 储运与装配时注意避免强机械应力与潮湿环境,包装开启后尽快回流以防潮湿对焊接质量的影响。
  • 虽然为被动元件,建议在静电敏感系统中维持一般 ESD 防护措施。

六、选型与采购提示

  • 若电路对精度与温漂有更高要求,可考虑更高精度或低 TCR 的薄膜/金属膜电阻产品。
  • 在明确最大工作电压与功耗条件下,核算实际功耗与安全余量(建议留有安全裕度以保证长期可靠性)。
  • 订购时请确认包装形式(卷带/盘带)、最小起订量与交期,以满足生产计划。

结语:0201WMJ0152TEE 以其超小封装与经济的厚膜工艺,适合对体积敏感且对精度要求一般的电子设计,是 UNI-ROYAL(厚声)在微型贴片电阻系列中的常用型号。如需更详细的可靠性试验数据、回流曲线或样品支持,可提供具体需求以便获取厂方资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.