WMSIC Electronic Components

UNI-ROYAL 0603WAF4022T5E

Model0603WAF4022T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF4022T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF4022T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
40.2kΩ
Electronic Component
1
Electronic Component
BM0257245553
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF4022T5E 产品概述

一、产品简介

0603WAF4022T5E 是 UNI-ROYAL(厚声)系列的贴片厚膜电阻,封装为 0603(约 1.6 mm × 0.8 mm),标称阻值 40.2 kΩ,精度 ±1%。该器件面向高密度表贴电路,兼顾功率承载与温度稳定性,适用于多种消费电子、工业及通信设备中的阻值分压、偏置与信号匹配等用途。

二、主要特性

  • 电阻类型:厚膜电阻(SMD)
  • 阻值:40.2 kΩ(标称)
  • 精度:±1%(J)
  • 功率额定:100 mW(环境基准条件下)
  • 工作电压:最大 75 V
  • 温度系数(TCR):±100 ppm/℃(典型)
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:0603 (1608 metric)
  • 品牌:UNI-ROYAL(厚声)

三、电气与热特性要点

该电阻适用于中高阻值场合,TCR ±100 ppm/℃ 在一般的模拟电路中能提供较好的漂移控制。100 mW 的额定功率适合小信号和偏置网络;在高温环境或窄空间中应按厂商给出的功率降额曲线进行设计,以避免超温。最大工作电压 75 V 在大多数低压应用中足够,但在高压场合需留有裕量。

四、典型应用场景

  • 模拟信号输入/分压/偏置电路
  • 滤波与阻抗匹配网络
  • 电源监控与电池管理电路
  • 工业控制与通信终端中的受限空间贴片设计

五、封装与焊接注意事项

0603 封装适合自动贴装与回流焊工艺。推荐遵循 UNI-ROYAL 的回流焊曲线和 PCB 焊盘布局规范,避免过长高温暴露和机械应力集中。贴片前注意防潮处理,存储和回流前如有拆封应按规定烘烤。

六、可靠性与环境适配

工作温度范围宽(-55 ℃ 到 +155 ℃),满足汽车电子和工业级的温度需求(但需核实是否满足 AEC-Q 要求)。厚膜结构在潮湿、振动和热循环条件下具有良好的一致性,常见可靠性试验包括高温老化、湿热、机械冲击与焊接热应力测试。

七、选型与订购建议

在设计时确认最大工作电压与功耗是否与实际工况匹配,若需更低温漂或更高功率,应选择薄膜或更大封装规格。订购时可按料号 0603WAF4022T5E 与 UNI-ROYAL 品牌索取正式数据手册与认证报告,以获取完整的降额曲线、回流曲线和可靠性试验数据。包装形式一般为卷带(T&R),适配 SMT 自动贴装。

如需,我可进一步整理该器件的 PCB 焊盘推荐尺寸、典型降额曲线示意与回流焊温度参考。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.