WMSIC Electronic Components

UNI-ROYAL 1206W4J0512T5E

Model1206W4J0512T5E
Package1206
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 1206W4J0512T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
1206W4J0512T5E
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.03g
Electronic Component
5.1kΩ
Electronic Component
1
Electronic Component
BM0257341427
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1206W4J0512T5E 产品概述

一、产品简介

1206W4J0512T5E 为 UNI-ROYAL(厚声)品牌的厚膜贴片电阻,封装为1206(常用尺寸约 3.2 × 1.6 mm)。标称阻值为 5.1 kΩ,阻值精度 ±5%,额定功率 250 mW,最高工作电压 200 V。该系列为通用型厚膜电阻,适合大批量表面贴装生产,成本与可靠性兼顾,广泛用于消费电子、工业控制及仪表等领域。

二、主要电气与环境参数

  • 电阻类型:厚膜电阻
  • 阻值:5.1 kΩ(标称)
  • 阻值公差:±5%(J)
  • 额定功率:250 mW(在规定散热条件下)
  • 最高工作电压:200 V
  • 温度系数(TCR):±100 ppm/°C
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:1206(表面贴装)

三、性能特点

  • 稳定性良好:厚膜工艺在常温及一般应力条件下表现出稳定的阻值漂移,适合通用电子电路使用。
  • 中等温漂:±100 ppm/°C 的温度系数适用于对温漂要求不极端严格的应用。
  • 耐压能力:200 V 的工作电压满足多数低压与中等电压场合的需求。
  • 经济可靠:适合批量生产与成本敏感型设计,且兼容常见贴片生产工艺。

四、典型应用场景

  • 消费类电子:家电控制板、音视频设备、微控制器外围电路。
  • 工业控制:传感器接口、信号调理、分压与限流电路(注意功率与电压限制)。
  • 仪表与测量:作为偏置、分压或阻抗匹配元件(在需高精度或低温漂场合建议选用更高精度/低TCR型号)。

五、使用与封装建议

  • 焊接工艺:适用于常规的SMT回流焊流程,焊接前后请参照制造商数据手册的温度曲线与预处理建议。
  • 散热与降额:在高温或较差散热条件下需按数据手册对额定功率进行降额使用,避免长期超额负载。
  • PCB 布局:为降低自热及热耦影响,建议在需要精确阻值的电路中提供足够的散热空间及铜箔面积。
  • 清洁与可靠性:避免强腐蚀性清洗剂与长时间潮湿环境,必要时采用符合行业规范的清洁工艺与防潮措施。

六、采购与质量支持

  • 型号示例:1206W4J0512T5E(请以实际订购编码为准)
  • 品牌:UNI-ROYAL(厚声)
  • 包装与数量:按卷盘或托盘供货,具体包装与每卷数量请参照供应商报价单。
  • 质量认证与合规性:如需 RoHS、REACH 或其它认证资料,请在采购时向供应商索取完整技术文件与测试报告。

如需完整技术规格、精确尺寸图或焊接/降额曲线,请提供电子邮件或直接索取制造商数据手册,以便获得详细参数与可靠性试验数据。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.