Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0402WGF6801TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF6801TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF6801TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 6.8kΩ
- Electronic Component
- 10
- Electronic Component
- BM0257242456
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF6801TCE 产品概述
一、产品简介
0402WGF6801TCE 是 UNI-ROYAL（厚声）出品的一款0402封装厚膜贴片电阻，标称阻值为6.8kΩ，精度±1%。额定功率为62.5mW（1/16W），工作电压50V，温度系数±100ppm/℃，工作温度范围为-55℃至+155℃，适用于空间受限和高密度贴装的电子产品。
二、主要特点
- 阻值稳定：公差为±1%，适合对阻值精度有一定要求的电路设计。
- 小型化封装：0402（约1.0mm × 0.5mm）适配高密度SMT板面布局，节省PCB面积。
- 宽温度范围：从-55℃到+155℃，满足工业级及部分汽车电子的温度需求。
- 良好的一致性与可焊性：采用厚膜工艺，端电极和外观符合SMT流片及回流焊工艺要求。
三、电气性能
- 标称阻值：6.8kΩ
- 精度：±1%
- 额定功率：62.5mW（典型环境温度下）
- 最大工作电压：50V（请按最大连续工作电压选型）
- 温度系数：±100ppm/℃，适合对温漂有中等要求的应用场景
四、封装与布局建议
- 封装：0402（约1.0mm × 0.5mm），具体外形尺寸以出厂规格书为准。
- 焊盘建议：建议按照IPC-7351推荐的0402焊盘布局进行PCB设计，并在样板制造前与供应商确认最终尺寸以保证良好贴装与焊接可靠性。
- 焊接工艺：支持常规回流焊，推荐遵循供应商回流曲线，避免超过推荐的最高回流温度和时间以防元件性能劣化。
五、可靠性与使用建议
- 热管理：62.5mW为额定功率，若环境温度升高需根据厂商的功率降额曲线进行降额使用，避免长期过载导致阻值漂移或失效。
- 储存与处理：避免潮湿、高温及强机械应力；在贴片、焊接及波峰前后应避免与腐蚀性气体接触。
- 测试与筛选：在关键应用中建议进行焊后阻值测试与高温老化验证，确保长期稳定性。
六、典型应用
适用于移动设备、消费电子、工业控制、传感器接口、滤波/偏置网络等对体积、精度及温度范围有要求的场景。
七、采购与技术支持
购买时请注明型号0402WGF6801TCE、阻值6.8kΩ、精度±1%，并向UNI-ROYAL（厚声）或授权代理索取最新规格书、回流曲线及可靠性数据，以便在设计与生产过程中获得最佳性能保证。
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