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UNI-ROYAL 0805W8J0105T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0805W8J0105T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0805W8J0105T5E
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.027g
- Electronic Component
- 1MΩ
- Electronic Component
- 1
- Electronic Component
- BM0257341723
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805W8J0105T5E 产品概述
一、产品简介
0805W8J0105T5E 为 UNI-ROYAL（厚声）系列贴片厚膜电阻，封装为0805（2012公制），阻值为1MΩ，精度±5%（J），额定功率125mW，额定工作电压150V，温度系数±100ppm/℃，工作温度范围 -55℃ 到 +155℃。该型号以成本效益高、批量一致性好著称，适用于需要高阻值且对成本敏感的通用电子应用。
二、主要技术参数
- 阻值：1MΩ
- 精度：±5%（J）
- 额定功率：0.125W（125mW）
- 额定工作电压：150V
- 温度系数（TCR）：±100ppm/℃
- 工作温度：-55℃ ~ +155℃
- 封装：0805（2.0 × 1.25 mm 典型）
- 制程类型：厚膜（Thick Film）
三、结构与封装说明
厚膜工艺通过在陶瓷基片上丝网印刷阻性浆料并高温烧结形成电阻薄膜，端接以金属化层，适配常规SMT工艺。0805封装在自动贴装和回流焊工艺中具有良好的可操作性，适合批量化生产与常规波峰/回流焊流程。
四、典型应用场景
- 高阻值分压器与偏置网络（低电流场合）
- 输入电路的漏电/隔离电阻、测量与传感前端的参考阻抗
- 滤波器、RC 时间常数电路（对阻值稳定性要求适中）
- 工业控制、通信终端、消费电子等对阻值精度要求不高且需节约成本的场合
五、可靠性与环境特性
厚膜电阻耐温范围宽、抗冲击和可焊性好，但高阻值器件对表面污染、湿度和爬电路径较为敏感。建议在清洗和封装时注意除去助焊剂残留并控制湿度。长期工作时应遵循功率和温度的降额使用准则，以延长寿命。
六、选型与使用注意事项
- 若电路需要更高精度或更低TCR，应考虑金属膜或薄膜高精度电阻。
- 避免长期接近或超过125mW的工作功率；在高环境温度下应进行功率降额。
- 高阻值器件在高湿或污染环境下易受表面泄漏影响，必要时采用涂覆或密封保护。
- 装配时遵循厂商推荐的焊盘尺寸与回流曲线，避免强机械应力导致端接裂纹。
本产品以经济型高阻值方案为侧重点，适合大批量、通用型电路设计中的阻抗需求。若需样品、规格书或可靠性测试数据，可联系供应商获取更详细信息。
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