WMSIC Electronic Components

UNI-ROYAL 0402WGF750JTCE

Model0402WGF750JTCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF750JTCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF750JTCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
75Ω
Electronic Component
10
Electronic Component
BM0227579995
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF750JTCE 产品概述 — UNI-ROYAL (厚声)

一、产品简介

0402WGF750JTCE 为 UNI-ROYAL(厚声)系列贴片厚膜电阻,阻值 75 Ω,精度 ±1%,额定功率 62.5 mW。封装尺寸为 0402(公制 1005),工作温度范围宽(-55 ℃ 至 +155 ℃),适合高密度表面贴装电路板的小功率阻值元件需求。

二、主要电气与热学参数

  • 类型:厚膜贴片电阻
  • 阻值:75 Ω
  • 精度:±1%(J 级)
  • 功率:62.5 mW(额定功率)
  • 温度系数(TCR):±100 ppm/℃
  • 工作电压:50 V(最大)
  • 工作温度范围:-55 ℃ 至 +155 ℃

三、结构与封装

0402(1005)超小尺寸设计,有利于高密度PCB布线与轻量化产品。厚膜工艺保证了成本效益与稳定的电阻特性,适用于自动贴片与回流焊装配工艺。标准化引脚端焊盘,便于可靠焊接与检修。

四、性能特点与优势

  • 小型化:0402 封装节省PCB空间,适合移动设备与便携仪器。
  • 稳定性:-55 ℃ 至 +155 ℃ 宽温工作能力,适合工业温度环境。
  • 精度与可控性:±1% 与 ±100 ppm/℃ 的组合可满足多数信号和偏置网络的精密需求。
  • 装配兼容:兼容常规贴片回流焊工艺,适合批量自动化生产。

五、典型应用场景

适用于移动通信终端、消费电子、传感器前端、滤波/分压网络、偏置与限流电路、一般电子测量仪器以及对体积和精度有要求的各类嵌入式设备。

六、使用建议与注意事项

  • 温度降额:在高环境温度下应考虑功率降额,避免长期靠近额定功率工作。
  • 焊接工艺:采用推荐的回流焊曲线,避免过长高温暴露以减少热应力。
  • 存储与防护:保持干燥包装,防止受潮;避免机械碰撞与静电损伤装配过程中的微裂痕。
  • 电压限制:实际应用中应确保工作电压低于 50 V,并考虑过压保护。

七、可靠性与质量控制

产品基于厚膜制造工艺,经过出厂阻值筛选与常规环境应力测试(高/低温循环、湿热与机械强度测试)。建议在关键应用中通过样机验证其长期漂移与热稳定性,以符合具体系统要求。

如需样品参数曲线、回流焊建议曲线或可靠性测试报告,可进一步提供具体资料与应用场景以便匹配更详细的技术支持。

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