WMSIC Electronic Components

UNI-ROYAL 0402WGJ0153TCE

Model0402WGJ0153TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGJ0153TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGJ0153TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
15kΩ
Electronic Component
10
Electronic Component
BM0258833848
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGJ0153TCE 产品概述

一 产品概述

0402WGJ0153TCE 为 UNI-ROYAL(厚声)系列贴片厚膜电阻,封装0402(约1.0 × 0.5 mm)。标称阻值 15 kΩ,公差 ±5%,额定功率 62.5 mW,工作温度范围 -55 ℃ 至 +155 ℃,温度系数(TCR)典型 ±100 ppm/℃。该型号定位为高密度表面贴装、低功耗通用型电阻,适合空间受限和低功耗应用。

二 主要参数

  • 电阻类型:厚膜贴片电阻
  • 阻值:15 kΩ(标称)
  • 精度:±5%(E24)
  • 功率:62.5 mW(在规定环境下的额定功率)
  • 允许工作电压:标称 50 V(见电气限制说明)
  • 温度系数:±100 ppm/℃
  • 工作温度:-55 ℃ ~ +155 ℃
  • 封装:0402(片式)
  • 品牌:UNI-ROYAL(厚声)

三 电气限制与实用计算

需要同时满足功率和额定电压两方面约束:

  • 由功率极限计算的最大直流电流:I_max = √(P/R) ≈ √(0.0625 / 15000) ≈ 2.04 mA。
  • 由功率极限计算的最大电压:V_power = √(P·R) ≈ 30.6 V。
    因此尽管额定工作电压标称为 50 V,实际使用时应确保施加电压既不超过厂方允许电压,又不使功率超载——即对 15 kΩ 阻值应优先按 ≈30.6 V 的功率限制来设计电压裕度。

四 特性与典型应用

  • 特性:体积小、适配高密度布线、耐温范围广、温漂一般(±100 ppm/℃),经济型通用元件。
  • 适用场景:便携与消费电子低功耗偏置电路、拉/下拉电阻、信号分压、微控制器输入网络、传感器前端的偏置及滤波场合。对高精度或高功率场合建议选用更高精度或更大功率等级产品。

五 可靠性、焊接与使用注意

  • 可靠性:适合在汽车电子温度范围外壳温度下工作,耐振动、耐热冲击能力取决于 PCB 设计与回流工艺;厚膜电阻一般具有良好的长期稳定性,但需注意长时间高温或过载会引起阻值漂移。
  • 回流焊建议:遵循元件厂与行业标准的回流曲线(峰值温度按 J-STD 推荐范围控制,避免长期超高温)。避免手工焊接长时间加热及过高焊接温度。
  • 布局与散热:0402 尺寸散热能力有限,布局时注意散热路径与邻近大功率器件隔离;对于连续耗散接近额定值的应用应留有降额裕量。
  • 清洁与储存:避免腐蚀性溶剂接触,湿度敏感度低于某些高端封装,但仍建议干燥保存并在合理时间内使用。

六 订购与包装建议

  • 通常以卷带(Tape & Reel)包装,便于 SMT 贴装。
  • 订购时请核对完整料号(0402WGJ0153TCE)、阻值与公差,确认包装数量和出厂测试条件。
  • 对于关键或大批量项目,建议索取厂方数据手册与可靠性测试报告以便最终验证设计可靠性。

如需更详细的回流曲线、阻值温漂测试曲线或环境应力测试数据,可提供具体需求以便查询厂方 Datasheet 与测试资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.