WMSIC Electronic Components

UNI-ROYAL 1206W4J0222T5E

Model1206W4J0222T5E
Package1206
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 1206W4J0222T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
1206W4J0222T5E
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.03g
Electronic Component
2.2kΩ
Electronic Component
1
Electronic Component
BM0257341645
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1206W4J0222T5E 产品概述

一 产品简介

1206W4J0222T5E 是 UNI-ROYAL(厚声)出品的一款厚膜贴片电阻,封装规格为 1206(约 3.2 × 1.6 mm),标称阻值 2.2 kΩ,阻值精度 ±5%,额定功率 250 mW,额定工作电压 200 V。该系列采用厚膜工艺制造,具有成本效益高、加工稳定、适配面广等特点,适用于多种通用电子产品与工业控制电路中的分压、限流与阻抗匹配等应用。

二 主要技术参数

  • 品牌:UNI-ROYAL(厚声)
  • 型号:1206W4J0222T5E
  • 电阻类型:厚膜电阻(贴片)
  • 阻值:2.2 kΩ
  • 精度:±5%(E24 系列)
  • 额定功率:250 mW
  • 额定工作电压:200 V
  • 温度系数(TCR):±100 ppm/℃(典型)
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:1206(约 3.2 × 1.6 mm)
  • 描述:贴片电阻 1206 2.2KΩ ±5%

三 特性与优势

  • 成本与性能平衡:厚膜工艺制造,成本低且量产稳定,适合大批量应用。
  • 稳定的电阻温度特性:TCR ±100 ppm/℃ 在多数通用电子环境中能提供可靠的阻值稳定性。
  • 宽温度适应性:-55 ℃ 至 +155 ℃ 的工作范围适应工业级环境需求。
  • 小型化封装:1206 封装兼顾电气功率与空间占用,适合 SMT 自动贴装与回流焊接。
  • 额定工作电压较高:200 V 额定工作电压满足较高压差场合的使用需求。
  • 通用性强:可用于滤波、分压、限流、偏置网络等常规电路。

四 典型应用场景

  • 消费电子:电视机、机顶盒、音响、家用电器的常规电阻网络与限流电路。
  • 通信设备:射频外围阻抗匹配(非高精度场合)、偏置与分压电路。
  • 工业控制:传感器接口、信号调理、限流与电压分压。
  • 电源与照明:LED 驱动、开关电源外围分压与检测电阻(注意功率与降额)。
  • 教育与实验板:通用电路实验与原型开发。

五 安装与焊接建议

  • SMT 兼容:适合常规 SMT 贴装与回流焊流程。为保证焊接可靠性,建议遵循生产线的标准回流曲线并参考厂方的焊接工艺规范。
  • 无铅回流适配:厚膜贴片电阻通常可承受无铅回流温度峰值,具体回流温度曲线与时长应以实际制造商数据为准。
  • 布局注意事项:尽量避免将功率较大的元件紧贴热敏器件,确保足够的散热区域;若用于功率较大场合,建议在 PCB 上增加散热铜面或改用更大封装/更高功率等级的电阻。
  • 安装方向:此类电阻无极性,贴装方向随意,但应避免在贴装过程中产生机械应力导致元件裂纹或可靠性下降。

六 可靠性与存储

  • 环境耐受性:工作温度范围为 -55 ℃ ~ +155 ℃,适用于大多数工业环境。长期在高温高湿环境下使用时,应关注阻值漂移与接触面氧化情况。
  • 存储建议:未使用的元件应保存在干燥、低粉尘、避免腐蚀性气体的环境中;密封包装和防潮卷带可延长保质期。若包装带有吸湿指示卡,按制造商建议进行预烘烤处理。
  • 可靠性测试:建议在关键应用中参考厂方的寿命与热循环、湿热、机械冲击等可靠性试验数据,以验证在特定应用中的长期稳定性。

七 选型与订购建议

  • 若应用中对阻值精度或温漂要求更高,请考虑更低 TCR 或更高精度(1% 或 0.5%)的产品。
  • 当工作环境温度、功率耗散或冲击电压超过该型号额定值时,请选用更大功率或更高电压等级的封装(例如 2010、2512 等)或金属膜/薄膜电阻替代。
  • 订购时请确认包装方式(卷带、盘装等)、最小订购量与交期,并向 UNI-ROYAL 厂家或代理索取详细数据表与可靠性报告以作最终确认。

该型号为通用型厚膜贴片电阻,兼顾成本与通用性,适合大多数常规电子设计与量产项目。选择前请结合具体电路的功率、温度与长期可靠性要求,参考制造商的完整数据资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.