Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0603WAF1801T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0603WAF1801T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0603WAF1801T5E
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 1.8kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257245293
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603WAF1801T5E 产品概述
一、产品简介
0603WAF1801T5E 为 UNI-ROYAL（厚声）系列厚膜贴片电阻，封装规格为 0603（英制 0201），标称阻值 1.8 kΩ，精度 ±1%，额定功率 100 mW，最大工作电压 75 V。典型温度系数为 ±100 ppm/℃，工作温度范围为 −55 ℃ 至 +155 ℃。该器件属于通用型厚膜芯片电阻，适合批量生产与自动化贴装工艺要求。
二、主要电气参数
- 阻值：1.8 kΩ（标称）
- 精度：±1%（线性精度）
- 额定功率：100 mW（在基准环境温度下）
- 最大工作电压：75 V
- 温度系数（TCR）：±100 ppm/℃（典型）
- 工作温度：−55 ℃ ~ +155 ℃
- 封装：0603（尺寸小，适合高密度 PCB）
三、性能特点与优势
- 小型化：0603 封装占板面积小，适用于空间受限的便携式与移动设备。
- 稳定性：厚膜工艺在常规环境下表现出良好的电阻稳定性与抗冲击能力，适合大多数消费电子与工业电子应用。
- 容差与精度：±1% 精度可满足精密分压、滤波、偏置和阻抗匹配等电路需求。
- 可回流焊兼容：适用于无铅回流焊工艺，便于现代 SMT 流程的可靠生产（建议按供应商回流温度曲线操作）。
- 宽温度范围：−55 ℃ 至 +155 ℃ 的工作温度范围适合多种环境应用。
四、设计与使用建议
- 温度降额：在高环境温度下应考虑功率降额，典型设计习惯是在 70 ℃ 以上按线性方式降额直至最高工作温度（具体降额曲线请参照厂方数据手册）。
- 板上散热：0603 封装散热能力有限，若在高功率或高环境温度场景使用，应增加铜箔面积或使用热沉设计以改善散热。
- 电压注意：实装电路时请确保额定工作电压不超过 75 V，尤其在脉冲或瞬态过压场合要留有裕量。
- 焊接工艺：遵循厂方推荐的回流温度曲线与焊膏用量，避免过热或长时间高温暴露，降低可靠性风险。
五、典型应用
- 移动通信与便携电子（偏置、分压、信号路径）
- 工业控制与仪器仪表（参考阻、采样电阻）
- IoT 与传感模块（小型化电阻网络）
- 消费类电子与家用电器（常规限流、滤波）
六、存储与可靠性
- 建议在干燥、常温环境下存储，避免潮湿与强腐蚀性气体环境。长期存储应遵循防潮包装要求，出库后尽快使用以保证焊接性能。
- 产品经严格品质测试（包括焊接热稳定、机械振动与温度循环测试），在正常使用条件下具有良好可靠性。具体寿命、老化与环境应力能力请参考 UNI-ROYAL 提供的完整数据手册与认证报告。
如需器件的详细机械尺寸图、温度降额曲线、封装吸湿等级（MSL）或可靠性试验数据，可提供零件号以便查询完整规格书及采购信息。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
