WMSIC Electronic Components

UNI-ROYAL 0603WAJ0220T5E

Model0603WAJ0220T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAJ0220T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAJ0220T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.023g
Electronic Component
22Ω
Electronic Component
10
Electronic Component
BM0257341357
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAJ0220T5E 产品概述

一、产品简介

0603WAJ0220T5E 是 UNI-ROYAL(厚声) 系列的贴片厚膜电阻,封装为 0603(1608 公制),阻值 22Ω,公差 ±5%,额定功率 100mW,最大工作电压 75V,温度系数 ±200ppm/℃,工作温度范围 -55℃ 至 +155℃。该型号适合一般电子设备中对功率与体积有平衡要求的阻抗元件应用。

二、主要参数

  • 阻值:22Ω
  • 精度:±5%
  • 功率:100mW
  • 最大工作电压:75V
  • 温度系数:±200ppm/℃(典型)
  • 工作温度:-55℃ ~ +155℃
  • 封装:0603(约 1.6mm × 0.8mm)
  • 品牌:UNI-ROYAL(厚声)

三、产品特性

  • 小型化封装,适合高密度贴装与自动化回流焊工艺;
  • 厚膜工艺,成本效益高,满足通用电路阻值要求;
  • 宽温度范围与较低温度系数,适合大多数商用与工业环境;
  • 良好的焊接性与机械强度,适合振动环境使用。

四、典型应用场景

  • 消费电子:移动设备、家电电源滤波与分流;
  • 工业控制:传感器接口、信号整形与限流电阻;
  • 通讯设备:偏置、终端匹配与去耦网络;
  • 原型开发与批量生产的通用电阻需求。

五、选型与使用建议

  • 额定功率受环境温度影响,应参考厂商温度-功率降额曲线。工作温度升高时需适当降额使用,以保证可靠性;
  • 最大工作电压 75V,实际电路中应确保电压与自发热不会导致超过阻值或可靠性极限;
  • 对精度、噪声或长期漂移有更高要求的应用,建议选择更高精度或金属薄膜电阻替代;
  • 设计 PCB 布局时,预留合适焊盘尺寸与热散布局,避免局部过热影响电阻功率承载。

六、存储、焊接与可靠性

  • 一般采用卷带(Tape & Reel)包装,便于 SMT 自动化贴片;建议在生产前按标准回流曲线进行焊接测试;
  • 厚膜贴片电阻通常兼容常见无铅回流工艺(峰值温度约 250–260℃),但应避免多次高温循环以减少漂移风险;
  • 存储环境应干燥、避免强腐蚀性气体;长期可靠性依赖于正确的回流、清洗与防潮措施。

本型号适合对体积、成本和通用性有要求的电路场景。更多详细的温度降额曲线、机械尺寸与寿命数据,请参阅厂商正式规格书以获得准确设计依据。

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