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UNI-ROYAL 1206W4F1000T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 1206W4F1000T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 1206W4F1000T5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 100Ω
- Electronic Component
- 1
- Electronic Component
- BM0257245092
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W4F1000T5E 产品概述 — UNI-ROYAL(厚声) 1206 贴片厚膜电阻 100Ω ±1%
一、产品简介
1206W4F1000T5E 为 UNI-ROYAL（厚声）系列的厚膜贴片电阻，封装为国际常用的 1206（约 3.2 mm × 1.6 mm）。标称阻值为 100Ω，允许偏差 ±1%，额定功率 250 mW，额定工作电压 200 V，温度系数（TCR）典型值 ±100 ppm/℃，工作温度范围为 -55℃ 至 +155℃。该型号以稳定的温漂、良好的焊接性与成熟的工艺稳定性适用于消费电子、工业控制、汽车电子（视认证而定）等领域的精密限流、分压与网络匹配等场景。
二、主要性能与特点
- 阻值与精度：100Ω，精度 ±1%，适合精密电阻网络和分压器应用。
- 功率与电压：250 mW 额定功率，最大工作电压 200 V（请在电路设计中严格控制峰值电压与瞬态）。
- 温度特性：TCR ±100 ppm/℃，在宽温区间内保持良好稳定性。
- 环境适应性：工作温度 -55℃ 至 +155℃，能满足大多数工业级温度要求。
- 封装优势：1206 尺寸兼顾功率与贴装密度，适合自动化贴片与回流焊工艺。
三、典型应用场景
- 精密分压与基准电路：高精度 ±1% 配合低 TCR，适用于参考电路的分压元件。
- 信号调理与滤波：与电容、电感配合用于 RC/滤波网络中的阻值元件。
- 电源限流与保护：在小功率电源或偏置电路中作为限流或检测电阻。
- 工业与通信设备：适合要求稳定性与长期可靠性的商用与工业电子产品。
四、安装与可靠性建议
- 焊接工艺：兼容常规无铅或有铅回流焊。为保证长期可靠性，建议遵循供应商的回流温度曲线与工艺规范。
- 热管理：在实际布板中，应考虑周边元件热耦合与铜箔面积对散热的影响，必要时增大散热铜层或采用散热设计以降低结温。
- 使用边界：避免长期在额定功率附近连续工作，建议预留安全裕度；严格控制工作电压不超过 200 V 以免产生击穿或电阻漂移。
- 存储与搬运：避免潮湿、高温及机械冲击，长期存放建议防潮包装并遵循生产厂家存储指南。
五、质量与采购提示
- 可靠性测试：常见的可靠性项目包括高低温循环、焊接耐热、机械冲击与振动、湿热测试等，建议向供应商索取相应的检测报告以满足项目验证需求。
- 包装与订购：该型号常见为贴片卷带包装，便于 SMT 自动贴装；具体卷盘数量、包装规格与交期请与供应商或授权代理商确认。
- 替代与兼容：1206 尺寸及 100Ω ±1% 的厚膜电阻在市场上有多家厂商可供选择，替换时请注意 TCR、功率、工作电压及可靠性测试一致性，以免影响整机性能。
如需更详细的电气特性曲线（如功率随环境温度的降额曲线、噪声系数、短时间过载能力等）、封装尺寸图或焊接工艺建议书，我可以为您整理并提供相应的技术资料与建议。
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