Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0603WAJ0200T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0603WAJ0200T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0603WAJ0200T5E
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.023g
- Electronic Component
- 20Ω
- Electronic Component
- 10
- Electronic Component
- BM0257342199
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603WAJ0200T5E 产品概述
一、产品简介
0603WAJ0200T5E 为 UNI-ROYAL（厚声）品牌的贴片厚膜电阻，封装尺寸为 0603（英制 0201），阻值 20Ω，标称精度 ±5%，额定功率 100mW，工作电压 75V，温度系数（TCR）±200ppm/℃，工作温度范围 -55℃ 至 +155℃。该器件面向通用电子设备中的信号限流、分压、阻抗匹配等应用场景。
二、主要性能特点
- 厚膜工艺制造，成本经济，适合大批量采购与一般精度需求的电路设计。
- 小尺寸（0603）适合高密度 PCB 布局，节省空间，提高元件密度。
- ±5% 精度满足一般模拟与数字电路的容差要求，TCR ±200ppm/℃在常温变化下稳定性良好。
- 额定工作电压 75V，可用于中低压信号与电源路径的限流与分压场合。
三、可靠性与环境适应
- 工作温度范围宽（-55℃~+155℃），能够适应绝大多数工业、消费类及车载环境的温度要求。
- 厚膜电阻相对于精密金属膜电阻，长期温漂与噪声略高，建议在对精密度与低噪声有严格要求的场合考虑更高等级产品。
- 在高温或高湿环境下使用时需遵循制造商的降额与可靠性说明，以保证长期稳定性。
四、封装与焊接注意事项
- 尺寸小，贴装时需使用合适的贴片吸嘴和精确的回流焊温控工艺；建议按制造商提供的回流曲线进行焊接。
- 建议参考 0603 标准焊盘尺寸与焊膏印刷设计，以避免焊接缺陷和机械应力集中。
- 避免在焊接后对电阻施加过大机械挠曲或直接冲击，以免引起断裂或阻值漂移。
五、典型应用场景
- 移动设备、消费电子的功率限流和分压电路。
- 工业控制、通信设备中的阻抗匹配与信号衰减网络。
- 各类传感器和测量电路中的通用阻值元件。
六、选型与采购建议
- 若系统对温漂、噪声或长期稳定性有更高要求，可考虑精密金属膜或合金膜电阻替代。
- 批量采购时注意确认包装形式（卷带/盘带）、阻值批次与检验报告，便于装配与质量追溯。
- 设计时预留适当的功率降额裕量并核查制造商数据手册，以确保实际工作条件下的可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
