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UNI-ROYAL 0402WGF2001TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF2001TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF2001TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 2kΩ
- Electronic Component
- 10
- Electronic Component
- BM0227383503
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF2001TCE 产品概述 — UNI-ROYAL(厚声) 0402 2KΩ ±1% 厚膜贴片电阻
一、主要电气参数
0402WGF2001TCE 为厚膜贴片电阻，标称阻值 2.00 kΩ，阻值精度 ±1%，额定功率 62.5 mW，最高工作电压 50 V，温度系数（TCR）±100 ppm/℃，工作温度范围 -55 ℃ 至 +155 ℃。封装尺寸为 0402（约 1.0 mm × 0.5 mm），品牌为 UNI-ROYAL（厚声）。
二、产品特点
- 厚膜工艺，成本优势明显，适合大批量生产应用；
- ±1% 精度满足多数模拟与数字电路对阻值容差的严格要求；
- TCR ±100 ppm/℃ 在温度波动环境下保持良好稳定性；
- 0402 超小封装，便于高密度 PCB 布局与空间受限设计；
- 额定工作电压 50 V，适用常见低压电子系统。
三、典型应用场景
适用于移动设备、消费电子、传感器前端、功率管理电路、滤波/分压网络、精密测量仪器的去耦、阻值配置与反馈回路等。小尺寸与可靠性能使其在高密度 SMT 布局中尤为常见。
四、封装与机械特性
0402 封装便于自动贴装与回流焊工艺，机械强度和可靠性由基底陶瓷与厚膜膜层决定。需注意在 PCB 焊盘设计时留有足够焊盘尺寸与焊膏量，以保证焊点可靠性及焊接一致性。
五、焊接与装配建议
- 推荐采用标准 SMT 回流工艺，按制造商给出的回流曲线（峰值温度及保温时间）进行；
- 避免在焊接或热循环中产生过度机械应力，板间冷却需均匀；
- 对于关键测量回路，焊后建议进行阻值检验以确认焊接无偏移。
六、选型与注意事项
- 若对噪声、长期稳定性或更低 TCR 有较高要求，可考虑薄膜或金属膜产品；
- 在高温或高功率场合，注意按功率降额曲线进行设计，避免超过器件热极限；
- 多并联或串联使用时需考虑阻值公差叠加和温漂影响。
七、储存与运输
请按一般电子元器件储存规范保存：干燥、无腐蚀性气体、避免阳光直射与剧烈震动。若为带盘或卷带包装，装箱后宜避免长时间受潮，必要时采用干燥剂或保湿袋。
八、质量与资料获取
UNI-ROYAL（厚声）产品普遍通过常规可靠性测试（高低温循环、湿热、机械振动等），具体规格、回流曲线和可靠性报告请以厂商最新 Datasheet 为准。订购时请确认完整料号 0402WGF2001TCE、阻值与包装方式（卷带/盘装）以避免型号混淆。
如需进一步的封装图、回流工艺建议、功率降额曲线或替代型号推荐，我可以根据您的应用环境提供更详尽的建议。
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