WMSIC Electronic Components

UNI-ROYAL 0805W8F2403T5E

Model0805W8F2403T5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8F2403T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8F2403T5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
240kΩ
Electronic Component
1
Electronic Component
BM0257341832
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8F2403T5E — UNI-ROYAL 厚膜贴片电阻 产品概述

一、产品简介

0805W8F2403T5E 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,封装为0805(2012公制),阻值 240kΩ,标称精度 ±1%,额定功率 125mW,最高工作电压 150V,温度系数(TCR) ±100ppm/℃,工作温度范围 -55℃ ~ +155℃。该产品适用于对体积、稳定性和可靠性有要求的表面贴装电子设备。

二、主要特性

  • 厚膜工艺,结构稳定、耐焊接应力与抗冲击能力良好。
  • 尺寸小巧(0805),适合高密度 PCB 布局与自动化 SMT 贴装。
  • ±1% 精度满足多数精密分压、偏置与反馈电路要求。
  • TCR ±100ppm/℃ 提供良好温度稳定性,适用于温度变化场合。
  • 宽温工作范围,可靠性符合工业级应用需求。

三、典型应用场景

  • 模拟电路中的精密分压与基准偏置电阻。
  • 信号处理、滤波和整流电路的阻值元件。
  • 消费电子、通讯设备、仪表仪器与测量电路。
  • 低功耗电路与高密度 SMT 模块。

四、使用与可靠性建议

  • 在高温环境下请按厂商功率降额曲线使用,避免持续超额负载。
  • 回流焊工艺应参照供应商的温度曲线;常规 SMT 回流温度曲线一般可兼容,但避免过长高温暴露。
  • 安装时注意焊盘设计与热分布,以降低热应力与焊点裂纹风险。
  • 储存应避光、干燥、防潮,湿敏等级及开封后回流限制请按供应商说明。

五、封装与订购说明

  • 标准 SMT 卷带(Tape & Reel)或托盘包装,便于自动化贴装与库存管理。
  • 型号说明中“0805”为封装,“2403”表示 240kΩ(240×10^3Ω),“T”类后缀通常与包装与合规性相关,订购时请确认完整料号与包装单位。

六、选型与替代建议

  • 若需更低温漂或更高功率,可考虑金属膜、薄膜或更大封装(1206、1210)方案。
  • 对极低噪声或高精度(±0.1%)需求,应选用低TCR、低漂移的薄膜或金属膜电阻。

如需完整电气特性曲线、功率降额曲线、回流焊规范或样品报价,可提供具体用途与环境条件以便推荐最合适的料号与封装选项。

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