WMSIC Electronic Components

UNI-ROYAL 0603WAF470JT5E

Model0603WAF470JT5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF470JT5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF470JT5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
47Ω
Electronic Component
10
Electronic Component
BM0230098249
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF470JT5E 产品概述

一 产品简介

0603WAF470JT5E 为 UNI-ROYAL(厚声)品牌的厚膜贴片电阻,封装规格为 0603(公制 1608,约 1.6 mm × 0.8 mm)。阻值 47 Ω,精度 ±1%,额定功率 0.1 W,额定工作电压 75 V,温度系数(TCR)±100 ppm/°C,工作温度范围 -55 ℃ 至 +155 ℃。该系列面向对尺寸、可靠性和成本有综合要求的消费电子与工业类产品。

二 主要参数(关键指标)

  • 电阻类型:厚膜电阻(贴片)
  • 阻值:47 Ω
  • 精度:±1%
  • 额定功率:0.1 W(100 mW)
  • 最高工作电压:75 V
  • 温度系数:±100 ppm/℃
  • 工作温度:-55 ℃ ~ +155 ℃
  • 封装:0603(1608 公制)
  • 品牌:UNI-ROYAL(厚声)

三 主要特性与优势

  • 小型化封装:0603 体积小,适合高密度 PCB 布局与自动贴装。
  • 精度较高:±1% 满足电路对精确阻值控制的需求。
  • 宽温度范围:-55 ℃ 至 +155 ℃,适用环境温度跨度大,适合部分工业类应用。
  • 成本效益:厚膜工艺在中低成本量产中具备优势。
  • 良好稳定性:典型厚膜电阻在常规应力下具有稳定的阻值漂移特性,适配多种电子系统。

四 典型应用场景

  • 移动设备、便携式电子的限流与偏置电路。
  • 消费类电子(电视机、机顶盒、音响等)与通讯设备中的通用阻值需求。
  • 工业控制与传感类电路中作为分压、限流或阻抗匹配元件(在允许的功率和电压范围内)。
  • 混合信号电路及原型板设计中的通用保护/偏置元件。

五 使用与降额建议

  • 建议在 25 ℃ 至 70 ℃ 范围内按额定功率使用;当环境温度上升时应线性降额,接近最高工作温度时需严控功耗,避免过载发热。
  • 在高电压应用中应考虑端到端耐压与电阻自热影响,75 V 为最大工作电压限制。
  • 对于要求更低温漂或更高功率的场合,建议选用薄膜或金属膜、高功率封装产品。

六 焊接与储存注意事项

  • 兼容无铅回流焊工艺,但须按照厂方推荐的回流曲线控制峰值温度与时间,避免过高温度导致性能退化。
  • 存放环境应避免潮湿、酸碱气体及强腐蚀性介质,建议干燥柜保管以减少吸湿与焊接缺陷。
  • 贴装时注意避免机械应力和过度焊接热冲击,遵循 PCB 设计与贴装工艺规范。

七 包装与采购提示

  • 常见包装形式为卷带(Tape & Reel),便于 SMT 自动贴装。
  • 订购时确认阻值、精度、功率、TCR 及封装等要素,必要时索取样品及可靠性测试报告以验证与目标应用的匹配性。

如需更详细的电热降额曲线、回流焊推荐曲线或可靠性测试数据,可提供具体应用环境与要求,我可协助核对并给出更精确的选型与使用建议。

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