Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0603WAF4021T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0603WAF4021T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0603WAF4021T5E
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 4.02kΩ
- Electronic Component
- 10
- Electronic Component
- BM0257341746
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603WAF4021T5E — 0603贴片厚膜电阻产品概述
一、产品简介
0603WAF4021T5E 为 UNI-ROYAL（厚声）品牌的 0603 封装厚膜贴片电阻，标称阻值 4.02 kΩ，公差 ±1%。该器件为小尺寸低功率通用电阻，适用于体积受限的表面贴装电路板（SMT）中作为信号分压、偏置、限流及阻抗匹配元件使用。
二、主要技术参数
- 阻值：4.02 kΩ
- 精度：±1%
- 功率额定：100 mW（标准环境条件下）
- 最大工作电压：75 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55 ℃ ~ +155 ℃
- 封装：0603（约 1.6 mm × 0.8 mm）
- 制程类型：厚膜电阻
三、结构与封装与焊接兼容性
0603 封装体积小、适合高密度贴装。产品采用常见的金属端电极结构，支持自动贴装与回流焊工艺。建议按通用无铅回流焊曲线进行焊接，注意控制峰值温度及焊接次数以避免性能退化。具体焊接工艺参数请参考厂商数据手册。
四、典型应用场景
- 消费类电子（移动设备、可穿戴）中的偏置、分压与限流
- 模拟前端与信号处理电路的阻抗匹配和耦合网络
- 传感器、采集模块的输入阻抗与滤波网络
- LED 驱动、逻辑拉高/拉低电路等低功耗应用
五、可靠性与使用建议
- 功率与温度：100 mW 为在参考温度下的额定消耗，实际使用中在高温环境需按厂商的功率降额曲线进行降额设计，避免过热导致阻值漂移或失效。
- 电压与脉冲：最大工作电压 75 V，应保证电路中持续施加的电压不超过此值，并考虑瞬态浪涌的影响。
- 精度与温漂：±1% 精度配合 ±100 ppm/℃ 的温漂适合中高精度场合，但对极低温漂或更高精度（如 0.1%）要求的应用，建议选用薄膜或精密电阻产品。
- 噪声与长期稳定性：厚膜工艺相较薄膜在噪声和长期稳定性上有一定差距，关键测量回路应评估噪声影响。
六、选型要点与采购建议
在设计选型时，优先核对阻值容差、额定功率、最大工作电压与温度系数是否满足应用要求；评估电路中的散热条件与可能的热源；若电路对噪声或长期稳定性敏感，考虑使用薄膜或更高等级产品。量产时建议向供应商索取完整数据手册与可靠性测试报告，并做好样品验证。
如需完整技术资料、功率降额曲线或可靠性测试数据，请联系供应商或参考 UNI-ROYAL 官方数据手册以获得最终参数与焊接规范。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
