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UNI-ROYAL 4D02WGJ0220TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 4D02WGJ0220TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 4D02WGJ0220TCE
- Electronic Component
- 1
- Package
- 0402x4
- Electronic Component
- Resistor Array
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 22Ω
- Electronic Component
- 8
- Electronic Component
- 1
- Electronic Component
- BM0257365941
- Electronic Component
- ±200ppm/℃
- Resistor
- 4
- Power
- 62.5mW
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
4D02WGJ0220TCE 产品概述
一、产品简介
4D02WGJ0220TCE 是 UNI‑ROYAL（厚声）出品的一款四联排阻网络，单元阻值 22Ω，公差 ±5%，每个电阻额定功率 62.5mW，温度系数（TCR）±200ppm/℃。封装形式为 0402x4，八引脚表面贴装，体积小、密度高，适用于空间受限的高密度电路板设计。该器件以稳定性与一致性为设计目标，可为多通道阻抗匹配、分压与去耦提供紧凑解决方案。
二、主要技术参数
- 阻值：22Ω（每单元）
- 精度：±5%
- 单个元件功率：62.5mW（环境温度及散热条件充分时）
- 温度系数：±200ppm/℃
- 单元数：4（四联）
- 引脚数：8（四对端子）
- 封装：0402x4 表面贴装，适合自动贴装与回流焊工艺
三、设计与布局建议
- 布局：将排阻尽量靠近源或负载放置，缩短连接线以降低寄生电感与电阻差异。若用于差分或多通道匹配，应保证各通道走线等长和对称。
- 走线与焊盘：推荐使用与厂商建议相符的焊盘尺寸以确保良好焊接；焊盘铜箔要均匀，避免单侧大面积铜会引起热不均。
- 热管理：单元功率受 PCB 散热条件影响明显。在高温或高功率应用中应考虑功率降额，避免连续满载；周围不宜紧邻高发热元件。
- 测试与校准：若用于阻值匹配敏感场合，可在板级测试后进行必要的筛选或批次匹配。
四、典型应用场景
- 数字电路的上拉/下拉网络（多通道统一阻值）
- 信号线阻抗终端与匹配（低阻值并列使用）
- 多路电平偏置或分压网络
- 空间受限的消费电子、通信模块、传感器模块与工业控制板
五、储存与注意事项
- 建议在干燥环境中保存，避免长期潮湿引起焊接质量问题；若长期存放，遵循厂商关于包装密封与干燥箱的建议。
- 回流焊工艺应按元件耐温规范设置温度曲线，避免超过推荐峰值温度及过长高温暴露时间。
- 操作时注意静电防护，避免强机械应力导致封装或引脚损伤。
六、采购与替代方案
- 型号：4D02WGJ0220TCE；品牌：UNI‑ROYAL（厚声）；封装：0402x4。
- 在选型时若需更高精度或更低 TCR，可考虑更高等级的多联排阻或采用单片精密电阻配对件；若功率需求更高，则需选择更大封装或分散为单独电阻元件。
本产品适合追求小型化与通道一致性的电路设计，选型时请结合实际功率、温度及布局条件进行评估。若需封装尺寸图、回流焊曲线或可靠性认证数据，可向供应商索取器件详细规格书（Datasheet）。
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