WMSIC Electronic Components

UNI-ROYAL 0402WGF2002TCE

Model0402WGF2002TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF2002TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF2002TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
20kΩ
Electronic Component
10
Electronic Component
BM0257242466
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF2002TCE 产品概述

一、产品简介

0402WGF2002TCE 是 UNI-ROYAL(厚声)推出的一款厚膜贴片电阻,封装为 0402(约 1.0 mm × 0.5 mm),阻值 20 kΩ,精度 ±1%,温度系数(TCR)±100 ppm/℃,额定功率 62.5 mW,最高工作电压 50 V,工作温度范围 -55℃ ~ +155℃。该器件面向高密度 SMT 布局与一般工业级电子产品,兼顾体积、性能与成本平衡。

二、主要参数

  • 电阻类型:厚膜电阻(Thick film)
  • 阻值:20 kΩ
  • 精度:±1%
  • 温度系数:±100 ppm/℃(典型工业级稳定性)
  • 额定功率:62.5 mW(0402 封装常规额定)
  • 最高工作电压:50 V
  • 工作温度:-55℃~+155℃
  • 封装:0402(约 1.0×0.5 mm)
  • 兼容性:适配常规无铅回流焊工艺,适用于自动贴装生产线

三、产品特点与优势

  • 小尺寸高密度:0402 封装适合现代移动终端、可穿戴设备与高密度主板布局,节省 PCB 面积。
  • 精度与温漂平衡:±1% 精度满足多数模拟与数字电路对阻值精确度的要求,±100 ppm/℃ 的温度系数在工业和消费类场景下提供稳定性。
  • 良好的一致性与可靠性:厚膜工艺成熟,具有稳定的批次一致性,工作温度范围宽,能在严苛环境下长期工作。
  • 工艺兼容:支持表面贴装自动化生产,适配主流回流焊工艺流程,便于大批量制造。

四、典型应用

  • 移动设备与可穿戴产品中的阻抗匹配、分压与偏置网络
  • IoT 终端、无线模组的拉/上拉电阻与滤波电路
  • 工业与汽车电子中对体积和成本敏感的通用阻值回路(需按应用确认环境与额定)
  • 仪表放大器输入网络、ADC 前端分压器(考虑匹配与噪声)
  • 消费电子、家电控制板与接口电路

五、使用建议与注意事项

  • 功率降额:在高环境温度下应进行功率降额设计,避免长期在额定功率极限附近运行以延长寿命。
  • 焊接: 与常规贴片电阻一致,建议按照供应商提供的回流曲线进行回流焊,避免过长时间高温暴露。
  • 机械应力:在 PCB 设计与手工装配时避免对电阻施加过大弯曲或机械应力,以防封装或端点损伤。
  • 噪声与精度:厚膜电阻在极低噪声或超高稳定性应用上不如薄膜电阻,若电路对噪声或长期漂移有严格要求,请与供应商确认更高等级产品。

六、包装与订购

0402WGF2002TCE 常见为卷带包装(Tape & Reel),便于 SMT 自动贴装。可按客户需求提供小样或批量供货,订购时请注明阻值、精度、封装与包装方式以便快速交付。

如需完整 Datasheet(包括电气特性曲线、回流焊温度曲线与可靠性测试数据)或样品支持,请联系供应商技术支持,以便获得详细安装与应用指导。

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