WMSIC Electronic Components

UNI-ROYAL 0402WGF100LTCE

Model0402WGF100LTCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF100LTCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF100LTCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
100mΩ
Electronic Component
1
Electronic Component
BM0257244987
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±800ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF100LTCE 产品概述

一、产品简介

0402WGF100LTCE 是 UNI-ROYAL(厚声)推出的一款0402封装厚膜贴片电阻,标称阻值为 100 mΩ,精度 ±1%,额定功率 62.5 mW,额定工作电压 50 V,温度系数(TCR)±800 ppm/℃,工作温度范围 -55 ℃ 至 +155 ℃。该器件适用于空间受限的低阻抗电流检测与分流测量场合,兼顾小体积与较高精度要求。

二、主要特性

  • 阻值:100 mΩ(0.1 Ω),精度 ±1%(满足精密测量的基线精度需求)
  • 功率:62.5 mW(0402 封装受限的热处理能力决定了较低功率)
  • 最大工作电压:50 V(器件耐压指标,实际使用受功耗限制)
  • TCR:±800 ppm/℃(约 0.08%/℃,热漂相对明显,需温度补偿或校准)
  • 温度范围:-55 ℃ ~ +155 ℃
  • 封装:0402(约 1.0 mm × 0.5 mm),适合高密度贴片布局

三、电气性能与设计注意事项

  1. 最大持续电流:由功率限制决定。Imax = sqrt(P/R) ≈ sqrt(0.0625 / 0.1) ≈ 0.79 A。
    在接近额定功率时,电阻两端电压 U = I·R ≈ 0.79 A × 0.1 Ω ≈ 79 mV。
    因此,尽管器件标称工作电压为 50 V,实际两端工作电压在额定功耗范围内通常只有几十毫伏。
  2. 示例计算:若工作电流为 0.5 A,则 P = I^2·R = 0.25·0.1 = 25 mW;两端电压约 50 mV,仍在安全范围内。
  3. 温度影响:TCR ±800 ppm/℃ 意味着每升高 1 ℃,阻值约变化 ±0.08%;温度波动 25 ℃ 会带来约 ±2% 的阻值漂移,超过初始 ±1% 精度,需软件或硬件温度补偿。
  4. 测量建议:低阻值测量务必采用四线(Kelvin)连接以消除引线和焊盘电阻的影响;测量电流宜用脉冲方式以降低自热误差。

四、应用场景

  • 电池管理系统(BMS)与便携设备的电流检测
  • 开关电源和 LED 驱动器的过流/电流采样
  • 电机控制与功率管理模块的短时电流感知
  • 通用电流监测、功率计量与保护电路中的分流器

五、封装、焊接与布局建议

  • 封装:0402,适合高密度 PCB。为保证散热与稳定性,建议在焊盘周围配置适当铜箔面积以增加热传导。
  • 焊接:建议采用标准无铅回流工艺(参考制造商回流曲线),遵循 JEDEC 建议的温度/时间限制,避免过长高温暴露。
  • 布局:电流测量回路应采用对称走线、短路径、较宽铜线以降低附加阻抗;测量端建议配置 Kelvin 焊盘和独立测量引线。
  • 包装:常见卷带(Tape & Reel),具体包装与最小订购量请参考供应商数据手册或业务联系人。

六、可靠性与选型建议

  • 由于厚膜工艺的 TCR 较高,若系统要求长期高精度(<±1% 总误差),建议采用温度补偿、在线校准或改用低 TCR(金属箔)分流电阻。
  • 在高环境温度或高功率连续工作场合,应做功率降额和热仿真,适当增加 PCB 散热面积或选用更大功率等级的分流器件。
  • 考虑电流冲击和浪涌保护,防止瞬态过流导致的器件热破坏。

如需更详细的回流曲线、热阻参数、寿命与可靠性试验数据或替代型号比较,可提供您的电路工况(最大工作电流、环境温度、板上铜厚/散热面积),我可根据这些信息给出更具体的选型与布局建议。

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