Model & package intelligence
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UNI-ROYAL 0402WGJ0122TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGJ0122TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGJ0122TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.009g
- Electronic Component
- 1.2kΩ
- Electronic Component
- 10
- Electronic Component
- BM0263574893
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGJ0122TCE 产品概述
一、产品简介
0402WGJ0122TCE 是 UNI-ROYAL（厚声）出品的一款0402封装厚膜贴片电阻，阻值 1.2 kΩ，公差 ±5%，标称功率 62.5 mW（1/16W），额定工作电压 50 V，温度系数（TCR）±100 ppm/℃，工作温度范围 -55℃ 至 +155℃。该型号面向高密度贴装和低功耗电子设备，兼顾体积最小化与基本性能稳定性。
二、主要电气参数
- 阻值：1.2 kΩ
- 精度：±5%
- 功率：62.5 mW（典型）
- 额定工作电压：50 V
- 温度系数：±100 ppm/℃
- 工作温度：-55℃ ~ +155℃
三、封装与物理特性
- 封装：0402（英制），适合超小型表贴设计
- 典型外形尺寸（mm，参考值）：1.0 × 0.5 × 0.45（长×宽×厚，具体以厂家资料为准）
- 制程：厚膜（陶瓷基板与厚膜碳/金属化膜）
四、主要特性与优势
- 小型化：0402 封装节省 PCB 面积，适用于空间受限的移动设备与可穿戴产品。
- 通用性：±5% 精度与 1.2 kΩ 阻值满足常见分压、偏置与阻抗匹配场景。
- 宽温度性能：-55℃ 至 +155℃ 的工作温度适应工业级环境需求。
- 兼容回流焊：适配主流回流焊工艺，便于批量贴装与生产线集成（请按供应商回流规范执行）。
五、典型应用场景
- 移动终端、蓝牙/无线模块、可穿戴设备的信号偏置与限流
- 传感器接口、滤波/分压网络、参考电路
- 工业控制、消费电子与物联网终端的通用阻值需求
六、使用与选型建议
- 对于高精度或低温漂应用，建议选用更低 TCR 或更高精度型号；
- 当电阻靠近功率极限工作时，应考虑散热和电阻自热对阻值的影响，尽量留有裕度；
- 封装尺寸导致可承受功率有限，设计时按实际环境温度与封装热阻估算功率降额；
- 采购与生产前，请向厂商索取完整数据手册，确认回流曲线、焊接耐受力及可靠性测试报告。
0402WGJ0122TCE 以其微小封装与可靠的基本电气性能，适合在对空间敏感且对成本与性能要求均衡的设计中广泛应用。欲了解详细规范和样品信息，请联系 UNI-ROYAL 厚声或其授权代理。
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